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Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB

Silva, Ângelo D M ; Silva, Mariana M ; Figueiredo, Hugo ; Delgado, Isabel ; Lopes, Paulo E ; Paiva, Maria C ; Hilliou, Loic

Materials, 2021-12, Vol.14 (24), p.7734 [Periódico revisado por pares]

Switzerland: MDPI AG

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Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB
Autor: Silva, Ângelo D M ; Silva, Mariana M ; Figueiredo, Hugo ; Delgado, Isabel ; Lopes, Paulo E ; Paiva, Maria C ; Hilliou, Loic
Assuntos: Carbon ; Carbon nanotubes ; Circuit boards ; Design ; Electrical properties ; electrically conductive adhesives ; Electronic components ; exfoliated graphite ; Geometry ; Lead free ; Pastes ; Printed circuits ; Printing ; Rheological properties ; Rheology ; Screen printing ; solder paste ; Soldering ; Solders ; stencil printing ; Surface mount technology ; Viscoelasticity ; Viscosity ; yield stress
É parte de: Materials, 2021-12, Vol.14 (24), p.7734
Notas: ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
Descrição: Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB.
Editor: Switzerland: MDPI AG
Idioma: Inglês

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Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB

Silva, Ângelo D M ; Silva, Mariana M ; Figueiredo, Hugo ; Delgado, Isabel ; Lopes, Paulo E ; Paiva, Maria C ; Hilliou, Loic

Switzerland: MDPI AG

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