Analytical, Numerical-, and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Ndip, Ivan ; Zoschke, Kai ; Lobbicke, Kai ; Wolf, M. Jurgen ; Guttowski, Stephan ; Reichl, Herbert ; Lang, Klaus-Dieter ; Henke, Heino

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-03, Vol.4 (3), p.504-515 [Periódico revisado por pares]

Piscataway: IEEE

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