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Electrical design and characterization of Si interposer for system-in-package (SiP)

Kato, S. ; Tango, T. ; Hasegawa, K. ; Bhandari, R.K. ; Sakai, A. ; Segawa, H. ; Kariya, T. ; Sudo, T.

2009 59th Electronic Components and Technology Conference, 2009, p.1648-1653

IEEE

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Título:
Electrical design and characterization of Si interposer for system-in-package (SiP)
Autor: Kato, S. ; Tango, T. ; Hasegawa, K. ; Bhandari, R.K. ; Sakai, A. ; Segawa, H. ; Kariya, T. ; Sudo, T.
Materias: Conductivity ; Conductors ; Delay ; Frequency ; Image processing ; Integrated circuit interconnections ; Large scale integration ; Power system interconnection ; Propagation losses ; Wiring
Es parte de: 2009 59th Electronic Components and Technology Conference, 2009, p.1648-1653
Descripción: Si interposer technology has the potential to enable high-bandwidth and low-power image processing devices of the future, because a very high density system with an ultra-fine pitch (les5um) wiring can be fabricated. However, the ultra-fine pitch wiring may adversely affect the electrical performance of devices. This paper discusses the signal propagation properties of ultra-fine coplanar interconnects on Si interposers. A design chart of the interconnects, obtained from the viewpoint of maximum line length versus target operating frequency, is presented.
Editor: IEEE
Idioma: Inglés

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