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Efficient fabrication process for superconducting integrated circuits using photosensitive polyimide insulation layers

Kikuchi, K. ; Goto, M. ; Nakagawa, H. ; Segawa, S. ; Tokoro, K. ; Taino, T. ; Myoren, H. ; Takada, S. ; Aoyagi, M.

IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.94-97 [Periódico revisado por pares]

New York, NY: IEEE

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Título:
Efficient fabrication process for superconducting integrated circuits using photosensitive polyimide insulation layers
Autor: Kikuchi, K. ; Goto, M. ; Nakagawa, H. ; Segawa, S. ; Tokoro, K. ; Taino, T. ; Myoren, H. ; Takada, S. ; Aoyagi, M.
Assuntos: Applied sciences ; Capacitors. Resistors. Filters ; Contact ; Contact holes ; Design. Technologies. Operation analysis. Testing ; Efficient fabrication process ; Electrical engineering. Electrical power engineering ; Electrodes ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Etching ; Exact sciences and technology ; Fabrication ; Insulation ; Integrated circuits ; Lithography ; Microelectronic fabrication (materials and surfaces technology) ; Niobium ; photosensitive polyimide ; Polyimide resins ; Polyimides ; Resistors ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Semiconductors ; Superconducting epitaxial layers ; superconducting integrated circuit ; Superconducting integrated circuits ; Superconductivity ; Various equipment and components
É parte de: IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.94-97
Notas: ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
Descrição: Photosensitive polyimide insulation layers have been introduced to fabricate superconducting integrated circuits. It is shown to simplify the fabrication process, because the photosensitive polyimide insulation layer can be patterned by conventional photolithography process, resulting in the etching process unnecessary in the present new fabrication process. Three kinds of contact hole (junction top electrode contact, junction base electrode contact, and resistor contact) are simultaneously formed in the photolithography process of the polyimide. A minimum contact hole size is designed to be 1.5 /spl mu/m square for a 3 /spl mu/m /spl times/ 3 /spl mu/m squared junction. Superconducting current density of 2.4/spl times/10/sup 6/ A/cm/sup 2/ of the contact hole was measured. Palladium resistors were successfully made with through hole contacts of the photosensitive polyimide insulation layer. We demonstrated superconducting integrated circuits using this new fabrication process including the minimum 3 /spl mu/m /spl times/ 3 /spl mu/m squared Nb/Al-AlO/sub x//Nb Josephson tunnel junction. The circuit operation is also demonstrated in the fabricated superconducting integrated circuits with the photosensitive polyimide insulation layers.
Editor: New York, NY: IEEE
Idioma: Inglês

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Efficient fabrication process for superconducting integrated circuits using photosensitive polyimide insulation layers

Kikuchi, K. ; Goto, M. ; Nakagawa, H. ; Segawa, S. ; Tokoro, K. ; Taino, T. ; Myoren, H. ; Takada, S. ; Aoyagi, M.

New York, NY: IEEE

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