Strain effects on n-InGaAs heterostructure-on-insulator made by direct wafer bonding
Rossel, C. ; Weigele, P. ; Czornomaz, L. ; Daix, N. ; Caimi, D. ; Sousa, M. ; Fompeyrine, J.
Solid-state electronics, 2014-08, Vol.98, p.88-92 [Periódico revisado por pares]Kidlington: Elsevier Ltd
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