Vertically high-density interconnection for mobile application
Katahira, Takayoshi ; Kartio, Ilkka ; Segawa, Hiroshi ; Takahashi, Michimasa ; Sagisaka, Katsumi
Microelectronics and reliability, 2006-05, Vol.46 (5), p.756-762 [Periódico revisado por pares]Oxford: Elsevier Ltd
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