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Optimal pinnate leaf-like network/matrix structure for enhanced conductive cooling

Hu, Liguo ; Zhou, Han ; Zhu, Hanxing ; Fan, Tongxiang ; Zhang, Di

Energy conversion and management, 2015-01, Vol.89, p.775-780 [Periódico revisado por pares]

Elsevier Ltd

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  • Título:
    Optimal pinnate leaf-like network/matrix structure for enhanced conductive cooling
  • Autor: Hu, Liguo ; Zhou, Han ; Zhu, Hanxing ; Fan, Tongxiang ; Zhang, Di
  • Assuntos: Architecture (computers) ; Channels ; Collection ; Conductive cooling ; Cooling ; Cooling effects ; Electronic devices ; Maximum temperature difference ; Network/matrix structure ; Networks ; Optimization ; Pinnate leaves
  • É parte de: Energy conversion and management, 2015-01, Vol.89, p.775-780
  • Notas: ObjectType-Article-1
    SourceType-Scholarly Journals-1
    ObjectType-Feature-2
    content type line 23
  • Descrição: •We present a pinnate leaf-like network/matrix structure for conductive cooling.•We study the effect of matrix thickness on network conductive cooling performance.•Matrix thickness determines optimal distance between collection channels in network.•We determine the optimal network architecture from a global perspective.•Optimal network greatly reduces the maximum temperature difference in the network. Heat generated in electronic devices has to be effectively removed because excessive temperature strongly impairs their performance and reliability. Embedding a high thermal conductivity network into an electronic device is an effective method to conduct the generated heat to the outside. In this study, inspired by the pinnate leaf, we present a pinnate leaf-like network embedded in the matrix (i.e., electronic device) to cool the matrix by conduction and develop a method to construct the optimal network. In this method, we first investigate the effect of the matrix thickness on the conductive cooling performance of the network, and then optimize the network architecture from a global perspective so that to minimize the maximum temperature difference between the heat sink and the matrix. The results indicate that the matrix thickness determines the optimal distance of the neighboring collection channels in the network, which minimizes the maximum temperature difference between the matrix and the network, and that the optimal network greatly reduces the maximum temperature difference in the network. The results can serve as a design guide for efficient conductive cooling of electronic devices.
  • Editor: Elsevier Ltd
  • Idioma: Inglês
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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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