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Refinado por: Base de dados/Biblioteca: IngentaConnect Journals remover assunto: Physical Sciences remover Microsystem Technologies : Sensors, Actuators, Systems Integration remover
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1
Wide bandgap semiconductor thin films for piezoelectric and piezoresistive MEMS sensors applied at high temperatures: an overview
Wide bandgap semiconductor thin films for piezoelectric and piezoresistive MEMS sensors applied at high temperatures: an overview
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Wide bandgap semiconductor thin films for piezoelectric and piezoresistive MEMS sensors applied at high temperatures: an overview

Fraga, M. A. ; Furlan, H. ; Pessoa, R. S. ; Massi, M.

Microsystem technologies : sensors, actuators, systems integration, 2014-01, Vol.20 (1), p.9-21 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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2
A multipurpose electrothermal microgripper for biological micro-manipulation
A multipurpose electrothermal microgripper for biological micro-manipulation
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A multipurpose electrothermal microgripper for biological micro-manipulation

Zhang, Ran ; Chu, Jinkui ; Wang, Haixiang ; Chen, Zhaopeng

Microsystem technologies : sensors, actuators, systems integration, 2013-01, Vol.19 (1), p.89-97 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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3
Underwater artificial lateral line flow sensors
Underwater artificial lateral line flow sensors
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Underwater artificial lateral line flow sensors

Shizhe, Tan

Microsystem technologies : sensors, actuators, systems integration, 2014-12, Vol.20 (12), p.2123-2136 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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4
Impact of alcohol additives concentration on etch rate and surface morphology of (100) and (110) Si substrates etched in KOH solutions
Impact of alcohol additives concentration on etch rate and surface morphology of (100) and (110) Si substrates etched in KOH solutions
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Impact of alcohol additives concentration on etch rate and surface morphology of (100) and (110) Si substrates etched in KOH solutions

Rola, Krzysztof P. ; Zubel, Irena

Microsystem technologies : sensors, actuators, systems integration, 2013-04, Vol.19 (4), p.635-643 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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5
Releasing high aspect ratio SU-8 microstructures using AZ photoresist as a sacrificial layer on metallized Si substrates
Releasing high aspect ratio SU-8 microstructures using AZ photoresist as a sacrificial layer on metallized Si substrates
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Releasing high aspect ratio SU-8 microstructures using AZ photoresist as a sacrificial layer on metallized Si substrates

Lau, Kia Hian ; Giridhar, Archit ; Harikrishnan, Sekar ; Satyanarayana, Nalam ; Sinha, Sujeet K.

Microsystem technologies : sensors, actuators, systems integration, 2013-11, Vol.19 (11), p.1863-1871 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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6
Fabrication of CNT-carbon composite microstructures using Si micromolding and pyrolysis
Fabrication of CNT-carbon composite microstructures using Si micromolding and pyrolysis
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Fabrication of CNT-carbon composite microstructures using Si micromolding and pyrolysis

He, Liang ; Toda, Masaya ; Kawai, Yusuke ; Miyashita, Hidetoshi ; Omori, Mamoru ; Hashida, Toshiyuki ; Berger, Rüdiger ; Ono, Takahito

Microsystem technologies : sensors, actuators, systems integration, 2014-02, Vol.20 (2), p.201-208 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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7
Design and simulation of a novel metallic microgripper using vibration to release nano objects actively
Design and simulation of a novel metallic microgripper using vibration to release nano objects actively
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Design and simulation of a novel metallic microgripper using vibration to release nano objects actively

Demaghsi, Hamed ; Mirzajani, Hadi ; Ghavifekr, Habib Badri

Microsystem technologies : sensors, actuators, systems integration, 2014-01, Vol.20 (1), p.65-72 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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8
Fabrication of an hermetically packaged silicon resonator on LTCC substrate
Fabrication of an hermetically packaged silicon resonator on LTCC substrate
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Fabrication of an hermetically packaged silicon resonator on LTCC substrate

Van Toan, Nguyen ; Miyashita, Hidetoshi ; Toda, Masaya ; Kawai, Yusuke ; Ono, Takahito

Microsystem technologies : sensors, actuators, systems integration, 2013-08, Vol.19 (8), p.1165-1175 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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9
Micromachined pyramidal shaped biodegradable microneedle and its skin penetration capability
Micromachined pyramidal shaped biodegradable microneedle and its skin penetration capability
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Micromachined pyramidal shaped biodegradable microneedle and its skin penetration capability

Shikida, Mitsuhiro ; Kitamura, Shingo ; Miyake, Chikara ; Bessho, Katsuhiko

Microsystem technologies : sensors, actuators, systems integration, 2014-12, Vol.20 (12), p.2239-2245 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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10
Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint
Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint
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Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint

Ismathullakhan, Shafiq ; Lau, Hungyin ; Chan, Yan-cheong

Microsystem technologies : sensors, actuators, systems integration, 2013-07, Vol.19 (7), p.1069-1080 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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