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From Topology Optimization Design to Additive Manufacturing: Today’s Success and Tomorrow’s Roadmap
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From Topology Optimization Design to Additive Manufacturing: Today’s Success and Tomorrow’s Roadmap

Meng, Liang ; Zhang, Weihong ; Quan, Dongliang ; Shi, Guanghui ; Tang, Lei ; Hou, Yuliang ; Breitkopf, Piotr ; Zhu, Jihong ; Gao, Tong

Archives of computational methods in engineering, 2020-07, Vol.27 (3), p.805-830 [Periódico revisado por pares]

Dordrecht: Springer Netherlands

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De novo biosynthesis of complex natural product sakuranetin using modular co-culture engineering
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De novo biosynthesis of complex natural product sakuranetin using modular co-culture engineering

Wang, Xiaonan ; Li, Zhenghong ; Policarpio, Lizelle ; Koffas, Mattheos A. G. ; Zhang, Haoran

Applied microbiology and biotechnology, 2020-06, Vol.104 (11), p.4849-4861 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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Genetic engineering of an industrial yeast Candida glycerinogenes for efficient production of 2-phenylethanol
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Genetic engineering of an industrial yeast Candida glycerinogenes for efficient production of 2-phenylethanol

Wang, Yuqin ; Zhang, Zhongyuan ; Lu, Xinyao ; Zong, Hong ; Zhuge, Bin

Applied microbiology and biotechnology, 2020-12, Vol.104 (24), p.10481-10491 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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A survey of millimeter wave communications (mmWave) for 5G: opportunities and challenges
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A survey of millimeter wave communications (mmWave) for 5G: opportunities and challenges

Niu, Yong ; Li, Yong ; Jin, Depeng ; Su, Li ; Vasilakos, Athanasios V.

Wireless networks, 2015-11, Vol.21 (8), p.2657-2676 [Periódico revisado por pares]

New York: Springer US

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A particle swarm optimization based energy efficient cluster head selection algorithm for wireless sensor networks
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A particle swarm optimization based energy efficient cluster head selection algorithm for wireless sensor networks

Rao, P. C. Srinivasa ; Jana, Prasanta K. ; Banka, Haider

Wireless networks, 2017-10, Vol.23 (7), p.2005-2020 [Periódico revisado por pares]

New York: Springer US

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6
Virtual, Digital and Hybrid Twins: A New Paradigm in Data-Based Engineering and Engineered Data
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Virtual, Digital and Hybrid Twins: A New Paradigm in Data-Based Engineering and Engineered Data

Chinesta, Francisco ; Cueto, Elias ; Abisset-Chavanne, Emmanuelle ; Duval, Jean Louis ; Khaldi, Fouad El

Archives of computational methods in engineering, 2020-01, Vol.27 (1), p.105-134 [Periódico revisado por pares]

Dordrecht: Springer Netherlands

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The Vibration Monitoring Methods and Signal Processing Techniques for Structural Health Monitoring: A Review
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The Vibration Monitoring Methods and Signal Processing Techniques for Structural Health Monitoring: A Review

Goyal, D. ; Pabla, B. S.

Archives of computational methods in engineering, 2016-12, Vol.23 (4), p.585-594 [Periódico revisado por pares]

Dordrecht: Springer Netherlands

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Special issue on machine learning and data-driven methods in fluid dynamics
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Special issue on machine learning and data-driven methods in fluid dynamics

Brunton, Steven L. ; Hemati, Maziar S. ; Taira, Kunihiko

Theoretical and computational fluid dynamics, 2020-08, Vol.34 (4), p.333-337 [Periódico revisado por pares]

Berlin/Heidelberg: Springer Berlin Heidelberg

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Sub-Grain Scale Digital Image Correlation by Electron Microscopy for Polycrystalline Materials during Elastic and Plastic Deformation
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Sub-Grain Scale Digital Image Correlation by Electron Microscopy for Polycrystalline Materials during Elastic and Plastic Deformation

Stinville, J.C. ; Echlin, M.P. ; Texier, D. ; Bridier, F. ; Bocher, P. ; Pollock, T.M.

Experimental mechanics, 2016-02, Vol.56 (2), p.197-216 [Periódico revisado por pares]

New York: Springer US

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Digital Volume Correlation: Review of Progress and Challenges
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Digital Volume Correlation: Review of Progress and Challenges

Buljac, A. ; Jailin, C. ; Mendoza, A. ; Neggers, J. ; Taillandier-Thomas, T. ; Bouterf, A. ; Smaniotto, B. ; Hild, F. ; Roux, S.

Experimental mechanics, 2018-06, Vol.58 (5), p.661-708 [Periódico revisado por pares]

New York: Springer US

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