Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed ElectronicsRyu, Jongeun ; Kim, Hak-Sung ; Hahn, H. ThomasJournal of electronic materials, 2011-01, Vol.40 (1), p.42-50 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
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Material Type: Artigo
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Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer FabricationHeryanto, A. ; Putra, W.N. ; Trigg, A. ; Gao, S. ; Kwon, W.S. ; Che, F.X. ; Ang, X.F. ; Wei, J. ; I Made, R. ; Gan, C.L. ; Pey, K.L.Journal of electronic materials, 2012-09, Vol.41 (9), p.2533-2542 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
3 |
Material Type: Artigo
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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical FatigueYin, Liang ; Wentlent, Luke ; Yang, Linlin ; Arfaei, Babak ; Oasaimeh, Awni ; Borgesen, PeterJournal of electronic materials, 2012-02, Vol.41 (2), p.241-252 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
4 |
Material Type: Artigo
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Silver Nanoparticle Paste for Low-Temperature Bonding of CopperAlarifi, Hani ; Hu, Anming ; Yavuz, Mustafa ; Zhou, Y. NormanJournal of electronic materials, 2011-06, Vol.40 (6), p.1394-1402 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
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Material Type: Artigo
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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification TemperatureArfaei, B. ; Kim, N. ; Cotts, E.J.Journal of electronic materials, 2012-02, Vol.41 (2), p.362-374 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
6 |
Material Type: Artigo
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Thin Thermoelectric Generator System for Body Energy HarvestingSettaluri, Krishna T. ; Lo, Hsinyi ; Ram, Rajeev J.Journal of electronic materials, 2012-06, Vol.41 (6), p.984-988 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
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Material Type: Artigo
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The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder JointsBieler, Thomas R. ; Zhou, Bite ; Blair, Lauren ; Zamiri, Amir ; Darbandi, Payam ; Pourboghrat, Farhang ; Lee, Tae-Kyu ; Liu, Kuo-ChuanJournal of electronic materials, 2012-02, Vol.41 (2), p.283-301 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
8 |
Material Type: Artigo
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High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics ApplicationsShnawah, Dhafer Abdulameer ; Said, Suhana Binti Mohd ; Sabri, Mohd Faizul Mohd ; Badruddin, Irfan Anjum ; Che, Fa XingJournal of electronic materials, 2012-09, Vol.41 (9), p.2631-2658 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
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Material Type: Artigo
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Waste Heat Recovery from a Marine Waste Incinerator Using a Thermoelectric GeneratorKristiansen, N. R. ; Snyder, G. J. ; Nielsen, H. K. ; Rosendahl, L.Journal of electronic materials, 2012-06, Vol.41 (6), p.1024-1029 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
10 |
Material Type: Artigo
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Electrical, Thermal, and Mechanical Characterization of Novel Segmented-Leg Thermoelectric ModulesD’Angelo, Jonathan ; Case, Eldon D. ; Matchanov, Nuraddin ; Wu, Chun-I ; Hogan, Timothy P. ; Barnard, James ; Cauchy, Charles ; Hendricks, Terry ; Kanatzidis, Mercouri G.Journal of electronic materials, 2011-10, Vol.40 (10), p.2051-2062 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |