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1
Grain boundary engineering of Co–Ni–Al, Cu–Zn–Al, and Cu–Al–Ni shape memory alloys by intergranular precipitation of a ductile solid solution phase
Grain boundary engineering of Co–Ni–Al, Cu–Zn–Al, and Cu–Al–Ni shape memory alloys by intergranular precipitation of a ductile solid solution phase
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Grain boundary engineering of Co–Ni–Al, Cu–Zn–Al, and Cu–Al–Ni shape memory alloys by intergranular precipitation of a ductile solid solution phase

Dar, Rebecca D. ; Yan, Haoxue ; Chen, Ying

Scripta materialia, 2016-04, Vol.115, p.113-117 [Periódico revisado por pares]

Elsevier Ltd

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2
Effect of grain boundary engineering on the microstructure and mechanical properties of copper containing austenitic stainless steel
Effect of grain boundary engineering on the microstructure and mechanical properties of copper containing austenitic stainless steel
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Effect of grain boundary engineering on the microstructure and mechanical properties of copper containing austenitic stainless steel

Sinha, Subhasis ; Kim, Dong-Ik ; Fleury, Eric ; Suwas, Satyam

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2015-02, Vol.626, p.175-185 [Periódico revisado por pares]

Elsevier B.V

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3
Selective laser melting of high strength Al–Cu–Mg alloys: Processing, microstructure and mechanical properties
Selective laser melting of high strength Al–Cu–Mg alloys: Processing, microstructure and mechanical properties
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Selective laser melting of high strength Al–Cu–Mg alloys: Processing, microstructure and mechanical properties

Zhang, Hu ; Zhu, Haihong ; Qi, Ting ; Hu, Zhiheng ; Zeng, Xiaoyan

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2016-02, Vol.656, p.47-54 [Periódico revisado por pares]

Elsevier B.V

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4
Research on the engineering application of multiple pulses treatment for recrystallization of fine copper wire
Research on the engineering application of multiple pulses treatment for recrystallization of fine copper wire
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Research on the engineering application of multiple pulses treatment for recrystallization of fine copper wire

Xu, Zhuohui ; Tang, Guoyi ; Tian, Shaoquan ; He, Jianchao

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-05, Vol.424 (1), p.300-306 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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5
Microstructure, texture and mechanical properties of cyclic expansion–extrusion deformed pure copper
Microstructure, texture and mechanical properties of cyclic expansion–extrusion deformed pure copper
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Microstructure, texture and mechanical properties of cyclic expansion–extrusion deformed pure copper

Pardis, N. ; Chen, C. ; Ebrahimi, R. ; Toth, L.S. ; Gu, C.F. ; Beausir, B. ; Kommel, L.

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2015-03, Vol.628, p.423-432 [Periódico revisado por pares]

Elsevier

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6
High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites
High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites
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High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

Li, Jianwei ; Wang, Xitao ; Qiao, Yi ; Zhang, Yang ; He, Zhanbing ; Zhang, Hailong

Scripta materialia, 2015-12, Vol.109, p.72-75 [Periódico revisado por pares]

Elsevier Ltd

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7
A model for the grain size dependent work hardening of copper
A model for the grain size dependent work hardening of copper
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A model for the grain size dependent work hardening of copper

Sinclair, C.W. ; Poole, W.J. ; Bréchet, Y.

Scripta materialia, 2006-10, Vol.55 (8), p.739-742 [Periódico revisado por pares]

New York, NY: Elsevier Ltd

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8
Deformation microstructures, strengthening mechanisms, and electrical conductivity in a Cu–Cr–Zr alloy
Deformation microstructures, strengthening mechanisms, and electrical conductivity in a Cu–Cr–Zr alloy
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Deformation microstructures, strengthening mechanisms, and electrical conductivity in a Cu–Cr–Zr alloy

Mishnev, R. ; Shakhova, I. ; Belyakov, A. ; Kaibyshev, R.

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2015-04, Vol.629, p.29-40 [Periódico revisado por pares]

Elsevier B.V

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9
Micromechanisms involved in grain boundary engineering of α-brass
Micromechanisms involved in grain boundary engineering of α-brass
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Micromechanisms involved in grain boundary engineering of α-brass

Pinto, Andre Luiz ; da Costa Viana, Carlos Sergio ; de Almeida, Luiz Henrique

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2007-02, Vol.445, p.14-19 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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10
The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion
The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion
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The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion

Huang, Yi ; Sabbaghianrad, Shima ; Almazrouee, Abdulla I. ; Al-Fadhalah, Khaled J. ; Alhajeri, Saleh N. ; Langdon, Terence G.

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2016-02, Vol.656, p.55-66 [Periódico revisado por pares]

Elsevier B.V

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