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Refinado por: Base de dados/Biblioteca: Copper Technical Reference Library remover assunto: Technology remover Surface & Coatings Technology remover
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Copper–tin electrodeposition from an acid solution containing EDTA added
Copper–tin electrodeposition from an acid solution containing EDTA added
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Copper–tin electrodeposition from an acid solution containing EDTA added

Barbano, E.P. ; de Oliveira, G.M. ; de Carvalho, M.F. ; Carlos, I.A.

Surface & coatings technology, 2014-02, Vol.240, p.14-22 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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2
Development of a sorbitol alkaline Cu–Sn plating bath and chemical, physical and morphological characterization of Cu–Sn films
Development of a sorbitol alkaline Cu–Sn plating bath and chemical, physical and morphological characterization of Cu–Sn films
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Development of a sorbitol alkaline Cu–Sn plating bath and chemical, physical and morphological characterization of Cu–Sn films

Finazzi, G.A. ; de Oliveira, E.M. ; Carlos, I.A.

Surface & coatings technology, 2004-10, Vol.187 (2), p.377-387 [Periódico revisado por pares]

Lausanne: Elsevier B.V

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3
Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper film
Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper film
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Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper film

Barbosa, L.L. ; de Almeida, M.R.H. ; Carlos, R.M. ; Yonashiro, M. ; Oliveira, G.M. ; Carlos, I.A.

Surface & coatings technology, 2005-03, Vol.192 (2), p.145-153 [Periódico revisado por pares]

Lausanne: Elsevier B.V

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