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1
First Results of the Magnetic Measurements of the Superconducting Magnets for the European XFEL
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First Results of the Magnetic Measurements of the Superconducting Magnets for the European XFEL

Brueck, H. ; Duda, M. ; Bandelmann, R. ; Calero, J. ; Gornicki, E. ; Kotarba, A. ; Martinez, T. ; Toral, F. ; Stolper, M.

IEEE transactions on applied superconductivity, 2014-06, Vol.24 (3), p.1-4 [Periódico revisado por pares]

New York, NY: IEEE

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2
Superconducting Solenoids for RF Accelerators and Electron Guns
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Superconducting Solenoids for RF Accelerators and Electron Guns

Nielsen, Gunver ; Hauge, Nils ; Krauthammer, Esben ; Thaarup, Klaus ; Baandrup, Leif O. ; Baurichter, Arnd

IEEE transactions on applied superconductivity, 2014-06, Vol.24 (3), p.1-5 [Periódico revisado por pares]

New York, NY: IEEE

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3
Microdispenser With Continuous Flow and Selectable Target Volume for Microfluidic High-Pressure Applications
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Microdispenser With Continuous Flow and Selectable Target Volume for Microfluidic High-Pressure Applications

Boden, Roger ; Ogden, Sam ; Hjort, Klas

Journal of microelectromechanical systems, 2014-04, Vol.23 (2), p.452-458 [Periódico revisado por pares]

New York, NY: IEEE

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4
A Si-Micromachined 162-Stage Two-Part Knudsen Pump for On-Chip Vacuum
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A Si-Micromachined 162-Stage Two-Part Knudsen Pump for On-Chip Vacuum

Seungdo An ; Gupta, Naveen K. ; Gianchandani, Yogesh B.

Journal of microelectromechanical systems, 2014-04, Vol.23 (2), p.406-416 [Periódico revisado por pares]

New York, NY: IEEE

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5
Rotational Capacitive Micromachined Ultrasonic Transducers (cMUTs)
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Rotational Capacitive Micromachined Ultrasonic Transducers (cMUTs)

Kuntzman, Michael L. ; Hall, Neal A.

Journal of microelectromechanical systems, 2014-02, Vol.23 (1), p.1-3 [Periódico revisado por pares]

New York, NY: IEEE

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6
Absorption enhancement of near infrared in Te doped nanoporous silicon
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Absorption enhancement of near infrared in Te doped nanoporous silicon

Su, Yuanjie ; Zhang, Peng ; Jiang, Jing ; Li, Shibin ; Wu, Zhiming ; Jiang, Yadong

Journal of materials science. Materials in electronics, 2013-07, Vol.24 (7), p.2197-2201 [Periódico revisado por pares]

Boston: Springer US

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7
A Unique Ka-Band Measurement System Based on Quasi-Optical Dielectric Resonator Technology for Studying Small Superconducting Samples
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A Unique Ka-Band Measurement System Based on Quasi-Optical Dielectric Resonator Technology for Studying Small Superconducting Samples

Wu, Y. ; Cui, B. ; Luo, S. ; Jiang, X. ; Zhou, F. ; Bian, Y. ; He, Y. ; Barannik, A. A. ; Cherpak, N. T. ; Skresanov, V. N.

IEEE transactions on applied superconductivity, 2013-06, Vol.23 (3), p.9000204-9000204 [Periódico revisado por pares]

New York, NY: IEEE

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8
Imaging of the Surface Resistance of an SRF Cavity by Low-Temperature Laser Scanning Microscopy
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Imaging of the Surface Resistance of an SRF Cavity by Low-Temperature Laser Scanning Microscopy

Ciovati, G. ; Anlage, S. M. ; Gurevich, A. V.

IEEE Transactions on Applied Superconductivity, 2013-06, Vol.23 (3), p.3500506-3500506 [Periódico revisado por pares]

New York, NY: IEEE

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9
Growth behaviors and characteristics of low temperature spin-sprayed ZnO and Al-doped ZnO microstructures
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Growth behaviors and characteristics of low temperature spin-sprayed ZnO and Al-doped ZnO microstructures

Obi, Ogheneyunume ; Zhou, Ziyao ; Beghun, Shawn ; Nan, Tianxiang ; Stoute, Stephen ; Liu, Ming ; Lou, Jing ; Yang, Xi ; Gao, Yuan ; Li, Ming ; Xing, Xing ; Sun, Nian X. ; Warzywoda, Juliusz ; Sacco, Albert ; Guo, Ting ; Nan, Cewen

Journal of materials science. Materials in electronics, 2013-06, Vol.24 (6), p.2058-2066 [Periódico revisado por pares]

Boston: Springer US

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10
The capacitance–voltage measurement of the screen-printed silicon solar cells with electrochemically etched nanostructured porous silicon antireflection coating
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The capacitance–voltage measurement of the screen-printed silicon solar cells with electrochemically etched nanostructured porous silicon antireflection coating

Vinod, P. Narayanan

Journal of materials science. Materials in electronics, 2013-04, Vol.24 (4), p.1395-1404 [Periódico revisado por pares]

Boston: Springer US

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