Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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Material Type: Artigo
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Optimizing the Convolution Operation to Accelerate Deep Neural Networks on FPGAMa, Yufei ; Cao, Yu ; Vrudhula, Sarma ; Seo, Jae-sunIEEE transactions on very large scale integration (VLSI) systems, 2018-07, Vol.26 (7), p.1354-1367 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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2 |
Material Type: Artigo
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High Throughput/Gate AES Hardware Architectures Based on Datapath CompressionUeno, Rei ; Homma, Naofumi ; Morioka, Sumio ; Miura, Noriyuki ; Matsuda, Kohei ; Nagata, Makoto ; Bhasin, Shivam ; Mathieu, Yves ; Graba, Tarik ; Danger, Jean-LucIEEE transactions on computers, 2020-04, Vol.69 (4), p.534-548 [Periódico revisado por pares]IEEETexto completo disponível |
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3 |
Material Type: Artigo
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An Efficient and Scalable Semiconductor Architecture for Parallel Automata ProcessingDlugosch, Paul ; Brown, Dave ; Glendenning, Paul ; Leventhal, Michael ; Noyes, HaroldIEEE transactions on parallel and distributed systems, 2014-12, Vol.25 (12), p.3088-3098 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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4 |
Material Type: Artigo
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Introduction to the Special Issue on Next-Generation On-Chip and Off-Chip Communication Architectures for Edge, Cloud and HPCKim, John ; Krishna, TusharACM journal on emerging technologies in computing systems, 2023-11, Vol.19 (4), p.1-1, Article 31 [Periódico revisado por pares]New York, NY: ACMTexto completo disponível |
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5 |
Material Type: Artigo
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An Energy-Efficient Architecture for Binary Weight Convolutional Neural NetworksWang, Yizhi ; Lin, Jun ; Wang, ZhongfengIEEE transactions on very large scale integration (VLSI) systems, 2018-02, Vol.26 (2), p.280-293 [Periódico revisado por pares]IEEETexto completo disponível |
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6 |
Material Type: Artigo
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LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered FaultsNi, Tianming ; Yao, Yao ; Chang, Hao ; Lu, Lin ; Liang, Huaguo ; Yan, Aibin ; Huang, Zhengfeng ; Wen, XiaoqingIEEE transactions on computer-aided design of integrated circuits and systems, 2020-10, Vol.39 (10), p.2938-2951 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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7 |
Material Type: Artigo
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Hardware-Based Trusted Computing Architectures for Isolation and AttestationMaene, Pieter ; Gotzfried, Johannes ; de Clercq, Ruan ; Muller, Tilo ; Freiling, Felix ; Verbauwhede, IngridIEEE transactions on computers, 2018-03, Vol.67 (3), p.361-374 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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8 |
Material Type: Artigo
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Device-Circuit-Architecture Co-Exploration for Computing-in-Memory Neural AcceleratorsJiang, Weiwen ; Lou, Qiuwen ; Yan, Zheyu ; Yang, Lei ; Hu, Jingtong ; Hu, Xiaobo Sharon ; Shi, YiyuIEEE transactions on computers, 2021-04, Vol.70 (4), p.595-605 [Periódico revisado por pares]IEEETexto completo disponível |
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9 |
Material Type: Artigo
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Systematic Design of an Approximate Adder: The Optimized Lower Part Constant-OR AdderDalloo, Ayad ; Najafi, Ardalan ; Garcia-Ortiz, AlbertoIEEE transactions on very large scale integration (VLSI) systems, 2018-08, Vol.26 (8), p.1595-1599 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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10 |
Material Type: Artigo
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Architecture of Cobweb-Based Redundant TSV for Clustered FaultsNi, Tianming ; Liu, Dongsheng ; Xu, Qi ; Huang, Zhengfeng ; Liang, Huaguo ; Yan, AibinIEEE transactions on very large scale integration (VLSI) systems, 2020-07, Vol.28 (7), p.1736-1739 [Periódico revisado por pares]New York: IEEETexto completo disponível |