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A reliability study of barrier-metal-clad copper interconnects with self-aligned metallic capsSaito, T. ; Ashihara, H. ; Ishikawa, K. ; Miyauchi, M. ; Yamada, Y. ; Nakano, H.IEEE transactions on electron devices, 2004-12, Vol.51 (12), p.2129-2135 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |