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Duromer MID technology for system-in-package generation
Duromer MID technology for system-in-package generation
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Duromer MID technology for system-in-package generation

Becker, K.-F. ; Braun, T. ; Neumann, A. ; Ostmann, A. ; Koch, M. ; Bader, V. ; Aschenbrenner, R. ; Reichl, H. ; Erik Jung

IEEE transactions on electronics packaging manufacturing, 2005-10, Vol.28 (4), p.291-296

New York: IEEE

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2
Stackable system-on-packages with integrated components
Stackable system-on-packages with integrated components
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Stackable system-on-packages with integrated components

Becker, K.-F. ; Erik Jung ; Ostmann, A. ; Braun, T. ; Neumann, A. ; Aschenbrenner, R. ; Reichl, H.

IEEE transactions on advanced packaging, 2004-05, Vol.27 (2), p.268-277

New York: IEEE

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3
Process flow and manufacturing concept for embedded active devices
Process flow and manufacturing concept for embedded active devices
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Process flow and manufacturing concept for embedded active devices

Aschenbrenner, R. ; Ostmann, A. ; Neumann, A. ; Reichl, H.

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.605-609

IEEE

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4
Electric Characteristics of Planar Interconnect Technologies for Power MOSFETs
Electric Characteristics of Planar Interconnect Technologies for Power MOSFETs
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Electric Characteristics of Planar Interconnect Technologies for Power MOSFETs

Dieckerhoff, S. ; Kirfe, T. ; Wernicke, T. ; Kallmayer, C. ; Ostmann, A. ; Jung, E. ; Wunderle, B. ; Reichl, H.

2007 IEEE Power Electronics Specialists Conference, 2007, p.1036-1042

IEEE

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5
Duromer MID technology for system in package generation
Duromer MID technology for system in package generation
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Duromer MID technology for system in package generation

Decker, K.-F. ; Braun, T. ; Neumann, A. ; Ostmann, A. ; Koch, M. ; Bader, V. ; Aschenbrenner, R. ; Reichl, H.

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004, 2004, p.72-77

Piscataway NJ: IEEE

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6
Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
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Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages

Manessis, D. ; Whitmore, M. ; Staddon, M. ; Ostmann, A. ; Aschenbrenner, R. ; Reichl, H.

2005 7th Electronic Packaging Technology Conference, 2005, Vol.1, p.6 pp.

IEEE

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7
A new approach for system integrated packaging
A new approach for system integrated packaging
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A new approach for system integrated packaging

Aschenbrenner, R. ; Ostmann, A. ; Jung, E. ; Landesberger, C. ; Reichl, H.

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000, p.41-45

IEEE

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8
Concepts for ultra thin packaging technologies
Concepts for ultra thin packaging technologies
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Concepts for ultra thin packaging technologies

Aschenbrenner ; Ansorge, F. ; Feil, M. ; Landesberger, C. ; Jung, E. ; Ostmann, A. ; Reichl, H.

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431), 2000, p.16-19

IEEE

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9
Flip chip soldering and adhesive bonding on organic substrates
Flip chip soldering and adhesive bonding on organic substrates
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Flip chip soldering and adhesive bonding on organic substrates

Jung, E. ; Aschenbrenner, R. ; Ostmann, A. ; Zakel, E. ; Reichl, H.

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 1995, p.67-71

IEEE

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10
Wafer level encapsulation for system in package generation
Wafer level encapsulation for system in package generation
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Wafer level encapsulation for system in package generation

Braun, T. ; Becker, K.-F. ; Koch, M. ; Bader, V. ; Manessis, D. ; Neumann, A. ; Ostmann, A. ; Aschenbrenner, R. ; Reichl, H.

26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003, 2003, p.505-511

IEEE

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