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Electronics
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Artigo
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A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloyJEON, Young-Doo ; NIELAND, Sabine ; OSTMANN, Andreas ; REICHL, Herbert ; PAIK, Kyung-WookJournal of electronic materials, 2003-06, Vol.32 (6), p.548-557 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 2 |
Material Type: Artigo
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Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgyJEON, Young-Doo ; PAIK, Kyung-Wook ; OSTMANN, Adreas ; REICHL, HerbertJournal of electronic materials, 2005, Vol.34 (1), p.80-90 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 3 |
Material Type: Artigo
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Ultra thin chips for miniaturized productsJUNG, E ; OSTMANN, A ; WOJAKOWSKI, D ; LANDESBERGER, C ; ASCHENBRENNER, R ; REICHL, HMicrosystem technologies : sensors, actuators, systems integration, 2003-09, Vol.9 (6-7), p.449-452 [Periódico revisado por pares]Berlin: SpringerTexto completo disponível |
| 4 |
Material Type: Artigo
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Stackable system-on-packages with integrated componentsBecker, K.-F. ; Erik Jung ; Ostmann, A. ; Braun, T. ; Neumann, A. ; Aschenbrenner, R. ; Reichl, H.IEEE transactions on advanced packaging, 2004-05, Vol.27 (2), p.268-277New York: IEEETexto completo disponível |
| 5 |
Material Type: Ata de Congresso
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Chip-in-polymer: volumetric packaging solution using PCB technologyJung, E. ; Wojakowski, D. ; Neumann, A. ; Landesberger, C. ; Ostmann, A. ; Aschenbrenner, R. ; Reichl, H.27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium, 2002, p.46-49Piscataway NJ: IEEETexto completo disponível |
| 6 |
Material Type: Artigo
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Electroless nickel/copper plating as a new bump metallizationAschenbrenner, R. ; Ostmann, A. ; Beutler, U. ; Simon, J. ; Reichl, H.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1995-05, Vol.18 (2), p.334-338New York, NY: IEEETexto completo disponível |
| 7 |
Material Type: Ata de Congresso
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Ultra thin chips for miniaturized productsJung, E. ; Neumann, A. ; Wojakowski, D. ; Ostmann, A. ; Landesberger, C. ; Aschenbrenner, R. ; Reichl, H.52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.1110-1113Piscataway NJ: IEEETexto completo disponível |
| 8 |
Material Type: Ata de Congresso
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Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0Ag-0.5Cu alloyYoung-Doo Jeon ; Nieland, S. ; Ostmann, A. ; Reichl, H. ; Kyung-Wook Paik52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.740-746Piscataway NJ: IEEETexto completo disponível |
| 9 |
Material Type: Ata de Congresso
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Duromer MID technology for system in package generationDecker, K.-F. ; Braun, T. ; Neumann, A. ; Ostmann, A. ; Koch, M. ; Bader, V. ; Aschenbrenner, R. ; Reichl, H.4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004, 2004, p.72-77Piscataway NJ: IEEETexto completo disponível |
| 10 |
Material Type: Ata de Congresso
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Electroless Plating on semiconductor wafersASCHENBRENNER, R ; OSTMANN, A ; REICHL, HProceedings - Electrochemical Society, 1998, p.67-71Pennington NJ: Electrochemical SocietyTexto completo disponível |
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