skip to main content
Idioma:
previous page 1 Resultados 2 3 4 5 next page
Mostrar Somente
Refinado por: assunto: Temperature remover
Result Number Material Type Add to My Shelf Action Record Details and Options
11
The Effect of Annealing on Tin Whisker Growth
The Effect of Annealing on Tin Whisker Growth
Material Type:
Artigo 		Adicionar ao Meu Espaço

The Effect of Annealing on Tin Whisker Growth

Fukuda, Y. ; Osterman, M. ; Pecht, M.

IEEE transactions on electronics packaging manufacturing, 2006-10, Vol.29 (4), p.252-258

New York: IEEE

Texto completo disponível

Citações Citado por
12
Environmental aging and deadhesion of siloxane-polyimide-epoxy adhesive
Environmental aging and deadhesion of siloxane-polyimide-epoxy adhesive
Material Type:
Artigo 		Adicionar ao Meu Espaço

Environmental aging and deadhesion of siloxane-polyimide-epoxy adhesive

Murray, S. ; Hillman, C. ; Pecht, M.

IEEE transactions on components and packaging technologies, 2003-09, Vol.26 (3), p.524-531 [Periódico revisado por pares]

New York: IEEE

Texto completo disponível

Citações Citado por
13
Modeling of IC Socket Contact Resistance for Reliability and Health Monitoring Applications
Modeling of IC Socket Contact Resistance for Reliability and Health Monitoring Applications
Material Type:
Artigo 		Adicionar ao Meu Espaço

Modeling of IC Socket Contact Resistance for Reliability and Health Monitoring Applications

Lopez, L.D. ; Pecht, M.G.

IEEE transactions on reliability, 2009-06, Vol.58 (2), p.264-270 [Periódico revisado por pares]

New York: IEEE

Texto completo disponível

Citações Citado por
14
Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach
Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach
Material Type:
Artigo 		Adicionar ao Meu Espaço

Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach

Haiyu Qi ; Osterman, M. ; Pecht, M.

IEEE transactions on advanced packaging, 2008-08, Vol.31 (3), p.463-472

Piscataway, NY: IEEE

Texto completo disponível

Citações Citado por
15
Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux
Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux
Material Type:
Artigo 		Adicionar ao Meu Espaço

Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux

Sheng Zhan ; Azarian, M.H. ; Pecht, M.G.

IEEE transactions on electronics packaging manufacturing, 2006-07, Vol.29 (3), p.217-223

New York, NY: IEEE

Texto completo disponível

Citações Citado por
16
Mahalanobis Distance and Projection Pursuit Analysis for Health Assessment of Electronic Systems
Mahalanobis Distance and Projection Pursuit Analysis for Health Assessment of Electronic Systems
Material Type:
Ata de Congresso 		Adicionar ao Meu Espaço

Mahalanobis Distance and Projection Pursuit Analysis for Health Assessment of Electronic Systems

Kumar, S. ; Sotiris, V. ; Pecht, M.

2008 IEEE Aerospace Conference, 2008, p.1-9

IEEE

Texto completo disponível

Citações Citado por
17
Placement for reliability and routability of convectively cooled PWBs
Placement for reliability and routability of convectively cooled PWBs
Material Type:
Artigo 		Adicionar ao Meu Espaço

Placement for reliability and routability of convectively cooled PWBs

Osterman, M.D. ; Pecht, M.

IEEE transactions on computer-aided design of integrated circuits and systems, 1990-07, Vol.9 (7), p.734-744 [Periódico revisado por pares]

New York, NY: IEEE

Texto completo disponível

Citações Citado por
18
Popcorning in PBGA Packages During IR Reflow Soldering
Popcorning in PBGA Packages During IR Reflow Soldering
Material Type:
Artigo 		Adicionar ao Meu Espaço

Popcorning in PBGA Packages During IR Reflow Soldering

McCluskey, P ; Munamarty, R ; Pecht, M

Microelectronics international, 1997-04, Vol.14 (1), p.20-23

Bradford: MCB UP Ltd

Texto completo disponível

Citações Citado por
19
Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits
Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits
Material Type:
Artigo 		Adicionar ao Meu Espaço

Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits

Pecht, M. ; Ranade, Y. ; Pecht, J.

Circuit world, 1997-12, Vol.23 (4), p.11-15 [Periódico revisado por pares]

Bradford: MCB UP Ltd

Texto completo disponível

Citações Citado por
20
A critique of the Reliability Analysis Center failure-rate-model for plastic encapsulated microcircuits
A critique of the Reliability Analysis Center failure-rate-model for plastic encapsulated microcircuits
Material Type:
Artigo 		Adicionar ao Meu Espaço

A critique of the Reliability Analysis Center failure-rate-model for plastic encapsulated microcircuits

Sinnadurai, N. ; Shukla, A.A. ; Pecht, M.

IEEE transactions on reliability, 1998-06, Vol.47 (2), p.110-113 [Periódico revisado por pares]

New York, NY: IEEE

Texto completo disponível

Citações Citado por
previous page 1 Resultados 2 3 4 5 next page

Personalize Seus Resultados

  1. Editar

Refine Search Results

Expandir Meus Resultados

  1.   

Mostrar Somente

  1. Revistas revisadas por pares (37)

Refinar Meus Resultados

Tipo de Recurso 

  1. Artigos  (45)
  2. Anais de Congresso  (13)
  3. magazinearticle  (6)
  4. Book Chapters  (1)
  5. Mais opções open sub menu

Data de Publicação 

De até
Refinar
  1. Antes de1990  (6)
  2. 1990Até1994  (8)
  3. 1995Até2001  (16)
  4. 2002Até2007  (13)
  5. Após 2007  (23)
  6. Mais opções open sub menu

  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

Buscando em bases de dados remotas. Favor aguardar.