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Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder
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Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder

Hillman, Dave ; Wilcoxon, Ross ; Pearson, Tim ; McKenna, Paul

Journal of electronic materials, 2019-08, Vol.48 (8), p.5241-5256 [Periódico revisado por pares]

New York: Springer US

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Ruthenium-tin cluster complexes and their applications as bimetallic nanoscale heterogeneous hydrogenation catalysts
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Ruthenium-tin cluster complexes and their applications as bimetallic nanoscale heterogeneous hydrogenation catalysts

Adams, Richard D. ; Trufan, Eszter

Philosophical transactions of the Royal Society of London. Series A: Mathematical, physical, and engineering sciences, 2010-03, Vol.368 (1915), p.1473-1493 [Periódico revisado por pares]

England: The Royal Society Publishing

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