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Material Type: Artigo
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Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu SolderHillman, Dave ; Wilcoxon, Ross ; Pearson, Tim ; McKenna, PaulJournal of electronic materials, 2019-08, Vol.48 (8), p.5241-5256 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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Material Type: Artigo
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Ruthenium-tin cluster complexes and their applications as bimetallic nanoscale heterogeneous hydrogenation catalystsAdams, Richard D. ; Trufan, EszterPhilosophical transactions of the Royal Society of London. Series A: Mathematical, physical, and engineering sciences, 2010-03, Vol.368 (1915), p.1473-1493 [Periódico revisado por pares]England: The Royal Society PublishingTexto completo disponível |