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Entropy Based Fatigue, Fracture, Failure Prediction and Structural Health Monitoring
Entropy Based Fatigue, Fracture, Failure Prediction and Structural Health Monitoring
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Entropy Based Fatigue, Fracture, Failure Prediction and Structural Health Monitoring

Basaran, Cemal

Entropy (Basel, Switzerland), 2020-10, Vol.22 (10), p.1178 [Periódico revisado por pares]

Switzerland: MDPI AG

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2
A Review of Damage, Void Evolution, and Fatigue Life Prediction Models
A Review of Damage, Void Evolution, and Fatigue Life Prediction Models
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A Review of Damage, Void Evolution, and Fatigue Life Prediction Models

Lee, Hsiao Wei ; Basaran, Cemal

Metals (Basel ), 2021-04, Vol.11 (4), p.609 [Periódico revisado por pares]

Basel: MDPI AG

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3
Condensation Flow of Refrigerants Inside Mini and Microchannels: A Review
Condensation Flow of Refrigerants Inside Mini and Microchannels: A Review
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Condensation Flow of Refrigerants Inside Mini and Microchannels: A Review

Başaran, Anıl ; Benim, Ali Cemal

Applied sciences, 2024-04, Vol.14 (7), p.2988 [Periódico revisado por pares]

Basel: MDPI AG

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4
Low Cycle Fatigue Life Prediction Using Unified Mechanics Theory in Ti-6Al-4V Alloys
Low Cycle Fatigue Life Prediction Using Unified Mechanics Theory in Ti-6Al-4V Alloys
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Low Cycle Fatigue Life Prediction Using Unified Mechanics Theory in Ti-6Al-4V Alloys

Bin Jamal M, Noushad ; Kumar, Aman ; Lakshmana Rao, Chebolu ; Basaran, Cemal

Entropy (Basel, Switzerland), 2019-12, Vol.22 (1), p.24 [Periódico revisado por pares]

Switzerland: MDPI AG

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5
Anisotropy of Graphene Nanoflake Diamond Interface Frictional Properties
Anisotropy of Graphene Nanoflake Diamond Interface Frictional Properties
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Anisotropy of Graphene Nanoflake Diamond Interface Frictional Properties

Zhang, Ji ; Osloub, Ehsan ; Siddiqui, Fatima ; Zhang, Weixiang ; Ragab, Tarek ; Basaran, Cemal

Materials, 2019-05, Vol.12 (9), p.1425 [Periódico revisado por pares]

Switzerland: MDPI AG

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6
Mechanical degradation of microelectronics solder joints under current stressing
Mechanical degradation of microelectronics solder joints under current stressing
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Mechanical degradation of microelectronics solder joints under current stressing

Ye, Hua ; Basaran, Cemal ; Hopkins, Douglas C.

International journal of solids and structures, 2003-12, Vol.40 (26), p.7269-7284 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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7
Damage mechanics of microelectronics solder joints under high current densities
Damage mechanics of microelectronics solder joints under high current densities
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Damage mechanics of microelectronics solder joints under high current densities

Ye, Hua ; Basaran, Cemal ; Hopkins, Douglas C.

International journal of solids and structures, 2003-07, Vol.40 (15), p.4021-4032 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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8
Analysis of multi-layered microelectronic packaging under uniformly distributed loading
Analysis of multi-layered microelectronic packaging under uniformly distributed loading
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Analysis of multi-layered microelectronic packaging under uniformly distributed loading

Wen, Yujun ; Basaran, Cemal

International journal of solids and structures, 2003-06, Vol.40 (13), p.3331-3345 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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9
Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems
Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems
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Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems

Sosnovskiy, Leonid ; Sherbakov, Sergei

Entropy (Basel, Switzerland), 2016-07, Vol.18 (7), p.268 [Periódico revisado por pares]

MDPI AG

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10
On the Development of Mechanothermodynamics as a New Branch of Physics
On the Development of Mechanothermodynamics as a New Branch of Physics
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On the Development of Mechanothermodynamics as a New Branch of Physics

Sosnovskiy, Leonid A. ; Sherbakov, Sergei S.

Entropy (Basel, Switzerland), 2019-12, Vol.21 (12), p.1188 [Periódico revisado por pares]

Basel: MDPI AG

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