8 Resultados para Busca Geral
Ordenado por:
Ordenado por:
RelevânciaOr hit Enter to replace sort method
- Relevância
- Data mais recente
- Data mais antiga
- Mais acessados
- Autor
- Título
Mostrar Somente
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Artigo
|
|
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithmGomez, Juan ; Basaran, CemalMechanics of materials, 2006-07, Vol.38 (7), p.585-598 [Periódico revisado por pares]Lausanne: Elsevier LtdTexto completo disponível |
| 2 |
Material Type: Artigo
|
|
Measuring intrinsic elastic modulus of Pb/Sn solder alloysBasaran, Cemal ; Jiang, JianbinMechanics of materials, 2002-06, Vol.34 (6), p.349-362 [Periódico revisado por pares]Lausanne: Elsevier LtdTexto completo disponível |
| 3 |
Material Type: Artigo
|
|
Failure modes and FEM analysis of power electronic packagingYe, Hua ; Lin, Minghui ; Basaran, CemalFinite elements in analysis and design, 2002-05, Vol.38 (7), p.601-612 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
| 4 |
Material Type: Artigo
|
|
Mechanical degradation of microelectronics solder joints under current stressingYe, Hua ; Basaran, Cemal ; Hopkins, Douglas C.International journal of solids and structures, 2003-12, Vol.40 (26), p.7269-7284 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
| 5 |
Material Type: Artigo
|
|
Damage mechanics of microelectronics solder joints under high current densitiesYe, Hua ; Basaran, Cemal ; Hopkins, Douglas C.International journal of solids and structures, 2003-07, Vol.40 (15), p.4021-4032 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
| 6 |
Material Type: Artigo
|
|
Analysis of multi-layered microelectronic packaging under uniformly distributed loadingWen, Yujun ; Basaran, CemalInternational journal of solids and structures, 2003-06, Vol.40 (13), p.3331-3345 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
| 7 |
Material Type: Artigo
|
|
Closed form vs. finite element analysis of laminated stacksBasaran, Cemal ; Zhao, YingFinite elements in analysis and design, 1999-06, Vol.32 (3), p.163-179 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
| 8 |
Material Type: Artigo
|
|
Thermomigration Versus Electromigration in Microelectronics Solder JointsAbdulhamid, M.F. ; Basaran, C. ; Yi-Shao LaiIEEE transactions on advanced packaging, 2009-08, Vol.32 (3), p.627-635Piscataway, NJ: IEEETexto completo disponível |
Personalize Seus Resultados
Refine Search Results
Expandir Meus Resultados
Mostrar Somente
Refinar Meus Resultados
Assunto
- Mechanics (7)
- Electronics (7)
- Fundamental Areas Of Phenomenology (5)
- Fracture Mechanics (4)
- Solid Mechanics (4)
- Semiconductor Electronics. Microelectronics. Optoelectronics. Solid State Devices (4)
- Structural And Continuum Mechanics (4)
- Fracture Mechanics, Fatigue And Cracks (3)
- Condensed Matter: Structure, Mechanical And Thermal Properties (3)
- Materials Science (3)
- Materials Science, Multidisciplinary (3)
- Electronic Packaging (2)
- Design. Technologies. Operation Analysis. Testing (2)
- Electromigration (2)
- Damage Mechanics (2)
-
Mais opções
Base de Dados/Biblioteca
- Science Citation Index Expanded (Web of Science) (8)
- ScienceDirect (7)
- BACON - Mir@bel - GLOBAL_LIBRESACCES (3)
- Free E-Journal (出版社公開部分のみ） (3)
- METADEX (2)
- Materials Research Database (2)
- IEEE Electronic Library (IEL) Journals (1)
- ANTE: Abstracts in New Technology & Engineering (1)
- Aerospace Database (1)
-
Mais opções
Nome da Publicação
Página Inicial
RSS
Feed
Políticas
Fale Conosco-
Realização:
Logos de Redes Sociais: 