Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Condensation Flow of Refrigerants Inside Mini and Microchannels: A ReviewBaşaran, Anıl ; Benim, Ali CemalApplied sciences, 2024-04, Vol.14 (7), p.2988 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
2 |
Material Type: Artigo
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Electrostatic Doping-Based All GNR Tunnel FET: An Energy-Efficient Design for Power ElectronicsZhang, Weixiang ; Ragab, Tarek ; Basaran, CemalIEEE transactions on electron devices, 2019-04, Vol.66 (4), p.1971-1978 [Periódico revisado por pares]New York: IEEETexto completo disponível |
3 |
Material Type: Artigo
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Shear Strength of Square Graphene Nanoribbons beyond WrinklingRagab, Tarek ; Basaran, CemalJournal of electronic materials, 2018-07, Vol.47 (7), p.3891-3896 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
4 |
Material Type: Artigo
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Measurement of high electrical current density effects in solder jointsYe, Hua ; Hopkins, Douglas C. ; Basaran, CemalMicroelectronics and reliability, 2003-12, Vol.43 (12), p.2021-2029 [Periódico revisado por pares]Elsevier LtdTexto completo disponível |
5 |
Material Type: Artigo
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Thermomigration Versus Electromigration in Microelectronics Solder JointsAbdulhamid, M.F. ; Basaran, C. ; Yi-Shao LaiIEEE transactions on advanced packaging, 2009-08, Vol.32 (3), p.627-635Piscataway, NJ: IEEETexto completo disponível |
6 |
Material Type: Artigo
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The Challenges of Advanced CMOS Process from 2D to 3DRadamson, Henry ; Zhang, Yanbo ; He, Xiaobin ; Cui, Hushan ; Li, Junjie ; Xiang, Jinjuan ; Liu, Jinbiao ; Gu, Shihai ; Wang, GuileiApplied sciences, 2017-10, Vol.7 (10), p.1047 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
7 |
Material Type: Ata de Congresso
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Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnectsCroes, K. ; Li, Y. ; Lofrano, M. ; Wilson, C. J. ; Tokei, Z.2013 IEEE International Reliability Physics Symposium (IRPS), 2013, p.2C.3.1-2C.3.4IEEETexto completo disponível |
8 |
Material Type: Artigo
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The effect of pre-aging on the electromigration of flip-chip SnAg solder jointsYang, Po-Chun ; Kuo, Chien-Chih ; Chen, ChihJOM (1989), 2008-06, Vol.60 (6), p.77-80 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |