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Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
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Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

Sukumaran, V. ; Bandyopadhyay, T. ; Sundaram, V. ; Tummala, R.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-09, Vol.2 (9), p.1426-1433 [Periódico revisado por pares]

Piscataway, NJ: IEEE

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2
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
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Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Sukumaran, Vijay ; Kumar, Gokul ; Ramachandran, Koushik ; Suzuki, Yuya ; Demir, Kaya ; Sato, Yoichiro ; Seki, Toshitake ; Sundaram, Venky ; Tummala, R. R.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-05, Vol.4 (5), p.786-795 [Periódico revisado por pares]

Piscataway: IEEE

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3
Ultrathin High- Q 2-D and 3-D RF Inductors in Glass Packages
Ultrathin High- Q 2-D and 3-D RF Inductors in Glass Packages
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Ultrathin High- Q 2-D and 3-D RF Inductors in Glass Packages

Kim, Min Suk ; Pulugurtha, Markondeya Raj ; Sundaram, Venky ; Tummala, Rao R. ; Yun, Hobie

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-04, Vol.8 (4), p.643-652 [Periódico revisado por pares]

IEEE

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4
Reliability of Copper Through-Package Vias in Bare Glass Interposers
Reliability of Copper Through-Package Vias in Bare Glass Interposers
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Reliability of Copper Through-Package Vias in Bare Glass Interposers

Demir, Kaya ; Armutlulu, Andac ; Sundaram, Venky ; Raj, P. Markondeya ; Tummala, Rao R.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-06, Vol.7 (6), p.829-837 [Periódico revisado por pares]

Piscataway: IEEE

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5
Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers
Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers
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Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers

Sangbeom Cho ; Sundaram, Venky ; Tummala, Rao R. ; Joshi, Yogendra K.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-08, Vol.5 (8), p.1075-1084 [Periódico revisado por pares]

Piscataway: IEEE

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6
Modeling, Fabrication, and Characterization of Low-Cost and High-Performance Polycrystalline Panel-Based Silicon Interposer With Through Vias and Redistribution Layers
Modeling, Fabrication, and Characterization of Low-Cost and High-Performance Polycrystalline Panel-Based Silicon Interposer With Through Vias and Redistribution Layers
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Modeling, Fabrication, and Characterization of Low-Cost and High-Performance Polycrystalline Panel-Based Silicon Interposer With Through Vias and Redistribution Layers

Qiao Chen ; Suzuki, Yuya ; Kumar, Gokul ; Sundaram, Venky ; Tummala, Rao R.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-12, Vol.4 (12), p.2035-2041 [Periódico revisado por pares]

IEEE

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7
Organic Damascene Process for 1.5- \mu m Panel-Scale Redistribution Layer Technology Using 5- \mu m-Thick Dry Film Photosensitive Dielectrics
Organic Damascene Process for 1.5- \mu m Panel-Scale Redistribution Layer Technology Using 5- \mu m-Thick Dry Film Photosensitive Dielectrics
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Organic Damascene Process for 1.5- \mu m Panel-Scale Redistribution Layer Technology Using 5- \mu m-Thick Dry Film Photosensitive Dielectrics

Fuhan Liu ; Nair, Chandrasekharan ; Kubo, Atsushi ; Ando, Tomoyuki ; Wei, Frank ; Sundaram, Venky ; Tummala, Rao R.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.792-801 [Periódico revisado por pares]

IEEE

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8
Demonstration of 10- \mu m Microvias in Thin Dry-Film Polymer Dielectrics for High-Density Interposers
Demonstration of 10- \mu m Microvias in Thin Dry-Film Polymer Dielectrics for High-Density Interposers
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Demonstration of 10- \mu m Microvias in Thin Dry-Film Polymer Dielectrics for High-Density Interposers

Suzuki, Yuya ; Furuya, Ryuta ; Sundaram, Venky ; Tummala, Rao R.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-02, Vol.5 (2), p.194-200 [Periódico revisado por pares]

IEEE

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9
Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor
Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor
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Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor

Kumar, A ; Xiaowu Zhang ; Qing Xin Zhang ; Ming Chinq Jong ; Guanbo Huang ; Vincent, L W S ; Kripesh, V ; Lee, C ; Lau, J H ; Dim Lee Kwong ; Sundaram, V ; Tummula, R R ; Meyer-Berg, G

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-06, Vol.1 (6), p.841-851 [Periódico revisado por pares]

Piscataway, NJ: IEEE

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10
Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers
Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers
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Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers

Jialing Tong ; Sato, Yoichiro ; Panayappan, Kadappan ; Sundaram, Venky ; Peterson, Andrew F. ; Tummala, Rao R.

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-05, Vol.6 (5), p.775-783 [Periódico revisado por pares]

Piscataway: IEEE

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