Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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Material Type: magazinearticle
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Lead-Free Solder Joint Void Evolution During Multiple Subsequent High-Temperature ReflowsYan Li ; Moore, J. S. ; Pathangey, B. ; Dias, R. C. ; Goyal, D.IEEE transactions on device and materials reliability, 2012-06, Vol.12 (2), p.494-500 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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Charge injection/extraction at a metal-dielectric interface: Experimental validationNeagu, E. ; Dias, C.IEEE electrical insulation magazine, 2009-01, Vol.25 (1), p.15-22New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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Rapid die heating for low-stress die attachFrutschy, K.J. ; Rangaraj, S.V. ; Dias, R.C.IEEE transactions on device and materials reliability, 2004-06, Vol.4 (2), p.153-162 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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Open DRM and the Future of MediaTorres, V. ; Serrao, C. ; Dias, M.S. ; Delgado, J.IEEE multimedia, 2008-04, Vol.15 (2), p.28-36 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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Integrating User Studies into Computer Graphics-Related CoursesSantos, B. S. ; Dias, P. ; Silva, S. ; Ferreira, C. ; Madeira, J.IEEE computer graphics and applications, 2011-09, Vol.31 (5), p.14-17 [Periódico revisado por pares]United States: IEEETexto completo disponível |
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Material Type: magazinearticle
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Cooperation strategies for vehicular delay-tolerant networksDias, Joao A. F. F. ; Rodrigues, Joel J. P. C. ; Kumar, Neeraj ; Saleem, KashifIEEE communications magazine, 2015-12, Vol.53 (12), p.88-94New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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Spectral Reconstruction and Bayesian Model Framework for Characterization of Long Period Fiber GratingsDias, Bernardo ; Santos, Paulo ; Jorge, Pedro A. S. ; de Almeida, Jose M. M. M. ; Coelho, Luis C. C.IEEE instrumentation & measurement magazine, 2021-08, Vol.24 (5), p.56-62New York: IEEETexto completo disponível |