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Material Type: Artigo
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Design Structure Matrix Extensions and Innovations: A Survey and New OpportunitiesBrowning, Tyson R.IEEE transactions on engineering management, 2016-02, Vol.63 (1), p.27-52 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Digital Twin in the IoT Context: A Survey on Technical Features, Scenarios, and Architectural ModelsMinerva, Roberto ; Lee, Gyu Myoung ; Crespi, NoelProceedings of the IEEE, 2020-10, Vol.108 (10), p.1785-1824 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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High Throughput/Gate AES Hardware Architectures Based on Datapath CompressionUeno, Rei ; Homma, Naofumi ; Morioka, Sumio ; Miura, Noriyuki ; Matsuda, Kohei ; Nagata, Makoto ; Bhasin, Shivam ; Mathieu, Yves ; Graba, Tarik ; Danger, Jean-LucIEEE transactions on computers, 2020-04, Vol.69 (4), p.534-548 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Optimizing the Convolution Operation to Accelerate Deep Neural Networks on FPGAMa, Yufei ; Cao, Yu ; Vrudhula, Sarma ; Seo, Jae-sunIEEE transactions on very large scale integration (VLSI) systems, 2018-07, Vol.26 (7), p.1354-1367 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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On the features and challenges of security and privacy in distributed internet of thingsRoman, Rodrigo ; Zhou, Jianying ; Lopez, JavierComputer networks (Amsterdam, Netherlands : 1999), 2013-07, Vol.57 (10), p.2266-2279 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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Material Type: Artigo
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Constant Envelope Hybrid Precoding for Directional Millimeter-Wave CommunicationsHuang, Yongming ; Zhang, Jianjun ; Xiao, MingIEEE journal on selected areas in communications, 2018-04, Vol.36 (4), p.845-859 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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On-Chip Interconnection Architecture of the Tile ProcessorWentzlaff, D. ; Griffin, P. ; Hoffmann, H. ; Liewei Bao ; Edwards, B. ; Ramey, C. ; Mattina, M. ; Chyi-Chang Miao ; Brown, J.F. ; Agarwal, A.IEEE MICRO, 2007-09, Vol.27 (5), p.15-31 [Periódico revisado por pares]Los Alamitos: IEEETexto completo disponível |
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Material Type: Artigo
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TrueNorth: Design and Tool Flow of a 65 mW 1 Million Neuron Programmable Neurosynaptic ChipAkopyan, Filipp ; Sawada, Jun ; Cassidy, Andrew ; Alvarez-Icaza, Rodrigo ; Arthur, John ; Merolla, Paul ; Imam, Nabil ; Nakamura, Yutaka ; Datta, Pallab ; Gi-Joon Nam ; Taba, Brian ; Beakes, Michael ; Brezzo, Bernard ; Kuang, Jente B. ; Manohar, Rajit ; Risk, William P. ; Jackson, Bryan ; Modha, Dharmendra S.IEEE transactions on computer-aided design of integrated circuits and systems, 2015-10, Vol.34 (10), p.1537-1557 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Data Center Network Virtualization: A SurveyBari, M. F. ; Boutaba, R. ; Esteves, R. ; Granville, L. Z. ; Podlesny, M. ; Rabbani, M. G. ; Qi Zhang ; Zhani, M. F.IEEE Communications surveys and tutorials, 2013, Vol.15 (2), p.909-928 [Periódico revisado por pares]IEEETexto completo disponível |
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Material Type: Artigo
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Biophilic design in architecture and its contributions to health, well-being, and sustainability: A critical reviewZhong, Weijie ; Schröder, Torsten ; Bekkering, JulietteFrontiers of architectural research, 2022-02, Vol.11 (1), p.114-141 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |