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Refinado por: Base de dados/Biblioteca: ANTE: Abstracts in New Technology & Engineering remover assunto: Physical Sciences remover
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On the mechanical properties and fracture patterns of the nonbenzenoid carbon allotrope (biphenylene network): a reactive molecular dynamics study
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On the mechanical properties and fracture patterns of the nonbenzenoid carbon allotrope (biphenylene network): a reactive molecular dynamics study

Pereira, M. L ; da Cunha, W. F ; de Sousa, R. T ; Amvame Nze, G. D ; Galvão, D. S ; Ribeiro, L. A

Nanoscale, 2022-02, Vol.14 (8), p.32-3211 [Periódico revisado por pares]

England: Royal Society of Chemistry

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Revealing the nature of low-temperature photoluminescence peaks by laser treatment in van der Waals epitaxially grown WS2 monolayers
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Revealing the nature of low-temperature photoluminescence peaks by laser treatment in van der Waals epitaxially grown WS2 monolayers

V Orsi Gordo ; Balanta, M A G ; Y Galvão Gobato ; Covre, F S ; Galeti, H V A ; Iikawa, F ; Couto, O D D ; F Qu ; Henini, M ; Hewak, D W ; Huang, C C

Nanoscale, 2018-01, Vol.10 (10), p.4807-4815 [Periódico revisado por pares]

Cambridge: Royal Society of Chemistry

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3
C60-derived nanobaskets: stability, vibrational signatures, and molecular trapping
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C60-derived nanobaskets: stability, vibrational signatures, and molecular trapping

dos Santos, S G ; Pires, M S ; Lemos, V ; Freire, V N ; Caetano, E W S ; Galvão, D S ; Sato, F ; Albuquerque, E L

Nanotechnology, 2009-09, Vol.20 (39), p.395701-395701 [Periódico revisado por pares]

England: IOP Publishing

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4
Multivariate analysis of the dielectric response of materials modeled using networks of resistors and capacitors
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Multivariate analysis of the dielectric response of materials modeled using networks of resistors and capacitors

Kawakami Harrop Galvao, Roberto ; Kienitz, K. H. ; Hadjiloucas, S. ; Walker, G. C. ; Bowen, J. W. ; Figueredo Carreiro Soares, Sofacles ; Ugulino Araujo, Mario Cesar

IEEE transactions on dielectrics and electrical insulation, 2013-06, Vol.20 (3), p.995-1008 [Periódico revisado por pares]

New York: IEEE

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