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1
Interior Degradation Analysis of Distributed Feedback Laser Using Optical-Beam-Induced Current
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Interior Degradation Analysis of Distributed Feedback Laser Using Optical-Beam-Induced Current

Takeshita, T. ; Oda, K. ; Mawatari, H.

IEEE transactions on device and materials reliability, 2014-12, Vol.14 (4), p.1074-1079 [Periódico revisado por pares]

New York: IEEE

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2
Quantitative Investigation of Laser Beam Modulation in Electrically Active Devices as Used in Laser Voltage Probing
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Quantitative Investigation of Laser Beam Modulation in Electrically Active Devices as Used in Laser Voltage Probing

Kindereit, U. ; Woods, G. ; Jing Tian ; Kerst, U. ; Leihkauf, R. ; Boit, C.

IEEE transactions on device and materials reliability, 2007-03, Vol.7 (1), p.19-30 [Periódico revisado por pares]

New York: IEEE

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3
Space Radiation Effects and Reliability Considerations for Micro- and Optoelectronic Devices
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Space Radiation Effects and Reliability Considerations for Micro- and Optoelectronic Devices

Johnston, A H

IEEE transactions on device and materials reliability, 2010-12, Vol.10 (4), p.449-459 [Periódico revisado por pares]

New York: IEEE

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4
Systematic Characterization of Integrated Circuit Standard Components as Stimulated by Scanning Laser Beam
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Systematic Characterization of Integrated Circuit Standard Components as Stimulated by Scanning Laser Beam

Glowacki, A.M. ; Brahma, S.K. ; Suzuki, H. ; Boit, C.

IEEE transactions on device and materials reliability, 2007-03, Vol.7 (1), p.31-49 [Periódico revisado por pares]

New York: IEEE

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5
The Impact of Mechanical Defects on the Reliability of Solar Cells in Aerospace Applications
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The Impact of Mechanical Defects on the Reliability of Solar Cells in Aerospace Applications

Zimmermann, C.G.

IEEE transactions on device and materials reliability, 2006-09, Vol.6 (3), p.486-494 [Periódico revisado por pares]

New York: IEEE

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6
Addendum: Modular heat sinks for desktop computers and other electronics
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magazinearticle
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Addendum: Modular heat sinks for desktop computers and other electronics

Klett, J.W. ; Trammell, M.

IEEE transactions on device and materials reliability, 2004-12, Vol.4 (4), p.638-640 [Periódico revisado por pares]

New York: IEEE

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7
Reliability-extrapolation methodology of semiconductor laser diodes: is a quick life test feasible?
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magazinearticle
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Reliability-extrapolation methodology of semiconductor laser diodes: is a quick life test feasible?

Huang, J.-S.

IEEE transactions on device and materials reliability, 2006-03, Vol.6 (1), p.46-51 [Periódico revisado por pares]

New York: IEEE

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8
Theoretical and experimental study on junction temperature of packaged Fabry-Perot laser diode
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magazinearticle
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Theoretical and experimental study on junction temperature of packaged Fabry-Perot laser diode

Jae-Ho Han ; Park, S.W.

IEEE transactions on device and materials reliability, 2004-06, Vol.4 (2), p.292-294 [Periódico revisado por pares]

New York: IEEE

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9
Rapid diagnostics of ASIC circuit marginalities using dynamic laser stimulation
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Rapid diagnostics of ASIC circuit marginalities using dynamic laser stimulation

Liao, J.Y. ; Woods, G.L. ; Marks, H.L.

IEEE transactions on device and materials reliability, 2006-03, Vol.6 (1), p.9-16 [Periódico revisado por pares]

New York: IEEE

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10
Scanning laser ultrasonics experiments for in situ nondestructive analysis of integrated circuits
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Scanning laser ultrasonics experiments for in situ nondestructive analysis of integrated circuits

Andriamonje, G. ; Pouget, V. ; Ousten, Y. ; Lewis, D. ; Plano, B. ; Danto, Y.

IEEE transactions on device and materials reliability, 2005-09, Vol.5 (3), p.564-571 [Periódico revisado por pares]

New York: IEEE

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