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Refinado por: Base de dados/Biblioteca: EBSCOhost Computers and Applied Sciences Complete remover Nome da Publicação: Journal Of Electronic Materials remover
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1
In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint
In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint
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In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint

Cornet, L. ; Yedra, L. ; Héripré, É. ; Schmitt, J.-H. ; Giorgi, M.-L. Aubin, V.

Journal of electronic materials, 2022-01, Vol.51 (4), p.1568-1582 [Periódico revisado por pares]

Institute of Electrical and Electronics Engineers

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2
Automotive Applications of Thermoelectric Materials
Automotive Applications of Thermoelectric Materials
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Automotive Applications of Thermoelectric Materials

Yang, Jihui ; Stabler, Francis R.

Journal of electronic materials, 2009-07, Vol.38 (7), p.1245-1251 [Periódico revisado por pares]

Boston: Springer US

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3
Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications
Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications
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Physical, Mechanical, and Structural Properties of Highly Efficient Nanostructured n- and p-Silicides for Practical Thermoelectric Applications

Gelbstein, Yaniv ; Tunbridge, Jonathan ; Dixon, Richard ; Reece, Mike J. ; Ning, Huanpo ; Gilchrist, Robert ; Summers, Richard ; Agote, Iñigo ; Lagos, Miguel A. ; Simpson, Kevin ; Rouaud, Cedric ; Feulner, Peter ; Rivera, Sergio ; Torrecillas, Ramon ; Husband, Mark ; Crossley, Julian ; Robinson, Ivan

Journal of electronic materials, 2014-06, Vol.43 (6), p.1703-1711 [Periódico revisado por pares]

Boston: Springer US

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4
Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities
Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities
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Thermoelectric Modules Based on Half-Heusler Materials Produced in Large Quantities

Bartholomé, Kilian ; Balke, Benjamin ; Zuckermann, Daniel ; Köhne, Martin ; Müller, Michael ; Tarantik, Karina ; König, Jan

Journal of electronic materials, 2014-06, Vol.43 (6), p.1775-1781 [Periódico revisado por pares]

Boston: Springer US

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5
GaN Technology for Power Electronic Applications: A Review
GaN Technology for Power Electronic Applications: A Review
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GaN Technology for Power Electronic Applications: A Review

Flack, Tyler J. ; Pushpakaran, Bejoy N. ; Bayne, Stephen B.

Journal of Electronic Materials, 2016-06, Vol.45 (6), p.2673-2682 [Periódico revisado por pares]

New York: Springer US

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6
Modeling and simulation of a thermoelectric generator using Bismuth Telluride for waste heat recovery in automotive Diesel engine
Modeling and simulation of a thermoelectric generator using Bismuth Telluride for waste heat recovery in automotive Diesel engine
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Modeling and simulation of a thermoelectric generator using Bismuth Telluride for waste heat recovery in automotive Diesel engine

Nour Eddine, Ali ; Sara, Hanna ; Chalet, David ; Faure, Xavier ; Aixala, Luc ; Cormerais, Mickaël

Journal of electronic materials, 2019-04 [Periódico revisado por pares]

Institute of Electrical and Electronics Engineers

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7
Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process
Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process
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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process

Hwang, Seyeon ; Reyes, Edgar I. ; Moon, Kyoung-sik ; Rumpf, Raymond C. ; Kim, Nam Soo

Journal of electronic materials, 2015-03, Vol.44 (3), p.771-777 [Periódico revisado por pares]

Boston: Springer US

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8
Analytical Calculation of Exciton Binding Energy, Quasi-Particle Band Gap and Optical Gap in Strained Mono-layer MoS2
Analytical Calculation of Exciton Binding Energy, Quasi-Particle Band Gap and Optical Gap in Strained Mono-layer MoS2
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Analytical Calculation of Exciton Binding Energy, Quasi-Particle Band Gap and Optical Gap in Strained Mono-layer MoS2

Ahmad, S. ; Zubair, M. ; Jalil, O. ; Ang, K.-W. ; Younis, U.

Journal of electronic materials, 2021-06, Vol.50 (6), p.2964-2973 [Periódico revisado por pares]

New York: Springer US

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9
Wearable Thermoelectric Generators for Body-Powered Devices
Wearable Thermoelectric Generators for Body-Powered Devices
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Wearable Thermoelectric Generators for Body-Powered Devices

Leonov, V. ; Vullers, R.J.M.

Journal of electronic materials, 2009-07, Vol.38 (7), p.1491-1498 [Periódico revisado por pares]

Boston: Springer US

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10
Performance Evaluation of Nano-scale Core–Shell Junctionless FETs in the Designing of Ultralow-Power Inverter and Ring Oscillator
Performance Evaluation of Nano-scale Core–Shell Junctionless FETs in the Designing of Ultralow-Power Inverter and Ring Oscillator
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Performance Evaluation of Nano-scale Core–Shell Junctionless FETs in the Designing of Ultralow-Power Inverter and Ring Oscillator

Seifollahi, Samaneh ; Ziabari, Seyed Ali Sedigh ; kiani-Sarkaleh, Azadeh

Journal of electronic materials, 2024-06, Vol.53 (6), p.3100-3116 [Periódico revisado por pares]

New York: Springer US

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