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A correlation-based design space exploration methodology for multi-processor systems-on-chip
A correlation-based design space exploration methodology for multi-processor systems-on-chip
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Ata de Congresso 		Adicionar ao Meu Espaço

A correlation-based design space exploration methodology for multi-processor systems-on-chip

Mariani, Giovanni ; Brankovic, Aleksandar ; Palermo, Gianluca ; Jovic, Jovana ; Zaccaria, Vittorio ; Silvano, Cristina

Design Automation Conference, 2010, p.120-125

New York, NY, USA: ACM

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2
An AIG-Based QBF-solver using SAT for preprocessing
An AIG-Based QBF-solver using SAT for preprocessing
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An AIG-Based QBF-solver using SAT for preprocessing

Pigorsch, Florian ; Scholl, Christoph

Design Automation Conference, 2010, p.170-175

New York, NY, USA: ACM

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3
Non-uniform clock mesh optimization with linear programming buffer insertion
Non-uniform clock mesh optimization with linear programming buffer insertion
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Non-uniform clock mesh optimization with linear programming buffer insertion

Guthaus, Matthew R. ; Wilke, Gustavo ; Reis, Ricardo

Design Automation Conference, 2010, p.74-79

New York, NY, USA: ACM

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4
The need for a full-chip and package thermal model for thermally optimized IC designs
The need for a full-chip and package thermal model for thermally optimized IC designs
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The need for a full-chip and package thermal model for thermally optimized IC designs

Huang, Wei ; Humenay, Eric ; Skadron, Kevin ; Stan, Mircea R.

ISLPED '05. Proceedings of the 2005 International Symposium on Low Power Electronics and Design, 2005, 2005, p.245-250

New York, NY, USA: ACM

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5
A model-driven design environment for embedded systems
A model-driven design environment for embedded systems
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Ata de Congresso 		Adicionar ao Meu Espaço

A model-driven design environment for embedded systems

Riccobene, E. ; Scandurra, P. ; Rosti, A. ; Bocchio, S.

2006 43rd ACM/IEEE Design Automation Conference, 2006, p.915-918

New York, NY, USA: ACM

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6
A study of Through-Silicon-Via impact on the 3D stacked IC layout
A study of Through-Silicon-Via impact on the 3D stacked IC layout
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A study of Through-Silicon-Via impact on the 3D stacked IC layout

Kim, Dae Hyun ; Athikulwongse, Krit ; Lim, Sung Kyu

2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, 2009, p.674-680

New York, NY, USA: ACM

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7
An efficient algorithm for finding empty space for online FPGA placement
An efficient algorithm for finding empty space for online FPGA placement
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An efficient algorithm for finding empty space for online FPGA placement

Handa, Manish ; Vemuri, Ranga

Proceedings of the 41st annual Design Automation Conference, 2004, p.960-965

New York, NY, USA: ACM

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8
Automated fixed-point data-type optimization tool for signal processing and communication systems
Automated fixed-point data-type optimization tool for signal processing and communication systems
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Automated fixed-point data-type optimization tool for signal processing and communication systems

Shi, Changchun ; Brodersen, Robert W.

Annual ACM IEEE Design Automation Conference: Proceedings of the 41st annual conference on Design automation; 07-11 June 2004, 2004, p.478-483

New York, NY, USA: ACM

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9
Improved global routing through congestion estimation
Improved global routing through congestion estimation
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Improved global routing through congestion estimation

Hadsell, Raia T. ; Madden, Patrick H.

Annual ACM IEEE Design Automation Conference: Proceedings of the 40th conference on Design automation; 02-06 June 2003, 2003, p.28-31

New York, NY, USA: ACM

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10
Automated compact dynamical modeling: an enabling tool for analog designers
Automated compact dynamical modeling: an enabling tool for analog designers
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Automated compact dynamical modeling: an enabling tool for analog designers

Bond, Bradley N. ; Daniel, Luca

Design Automation Conference, 2010, p.415-420

New York, NY, USA: ACM

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