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1
Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding
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Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding

Peng, J. ; Liu, H. S. ; Ma, H. B. ; Shi, X. M. ; Wang, R. C.

Journal of materials science, 2018-06, Vol.53 (12), p.9287-9296 [Periódico revisado por pares]

New York: Springer US

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2
Effects of Co addition on shear strength and interfacial microstructure of Sn–Zn–(Co)/Ni joints
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Effects of Co addition on shear strength and interfacial microstructure of Sn–Zn–(Co)/Ni joints

Li, J. Y. ; Peng, J. ; Wang, R. C. ; Feng, Y. ; Peng, C. Q.

Journal of materials science. Materials in electronics, 2018-12, Vol.29 (23), p.19901-19908 [Periódico revisado por pares]

New York: Springer US

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3
Significantly enhanced ductility of Sn–57Bi–1Ag alloy induced by microstructure modulation from in addition
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Significantly enhanced ductility of Sn–57Bi–1Ag alloy induced by microstructure modulation from in addition

Xiao, K. X. ; Li, C. J. ; Gao, P. ; Qin, J. H. ; Guo, S. X. ; Zhao, L. Y. ; Zhang, J. T. ; He, Q. ; Peng, J. B. ; Yi, J. H.

Journal of materials science. Materials in electronics, 2023-07, Vol.34 (20), p.1551, Article 1551 [Periódico revisado por pares]

New York: Springer US

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4
High conductivity and high strength Mg-Zn-Cu alloy
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High conductivity and high strength Mg-Zn-Cu alloy

Pan, H. ; Pan, F. ; Wang, X. ; Peng, J. ; She, J. ; Zhao, C. ; Huang, Q. ; Song, K. ; Gao, Z.

Materials science and technology, 2014-06, Vol.30 (7), p.759-764 [Periódico revisado por pares]

London, England: Taylor & Francis

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5
Microstructure and thermal conductivity of as-cast and as-extruded binary Mg-Mn alloys
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Microstructure and thermal conductivity of as-cast and as-extruded binary Mg-Mn alloys

Zhong, L. ; Peng, J. ; Sun, Y. ; Wang, Y. ; Lu, Y. ; Pan, F.

Materials science and technology, 2017-01, Vol.33 (1), p.92-97 [Periódico revisado por pares]

London, England: Taylor & Francis

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6
Electromechanical Characterization of Single GaN Nanobelt Probed with Conductive Atomic Force Microscope
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Electromechanical Characterization of Single GaN Nanobelt Probed with Conductive Atomic Force Microscope

Yan, X. Y. ; Peng, J. F. ; Yan, S. A. ; Zheng, X. J.

Journal of electronic materials, 2018-07, Vol.47 (7), p.3869-3875 [Periódico revisado por pares]

New York: Springer US

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7
Thermal and electrical conductivity of Mg-Zn-Al alloys
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Thermal and electrical conductivity of Mg-Zn-Al alloys

Pan, H. ; Pan, F. ; Yang, R. ; Peng, J. ; Tang, A. ; Huang, Q. ; Song, K. ; Gao, Z.

Materials science and technology, 2014-07, Vol.30 (8), p.988-994 [Periódico revisado por pares]

London, England: Taylor & Francis

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8
Single step synthesis of indium tin oxide by ultrasonic spray and microwave assisted pyrolysis
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Single step synthesis of indium tin oxide by ultrasonic spray and microwave assisted pyrolysis

Guo, S. ; Zhou, C. ; Zhang, L. ; Yang, X. ; Peng, J. ; Zhang, L.

Materials science and technology, 2015-08, Vol.31 (11), p.1376-1382 [Periódico revisado por pares]

London, England: Taylor & Francis

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9
Microwave initiated self-propagating high temperature synthesis of materials
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Microwave initiated self-propagating high temperature synthesis of materials

Peng, J.-H. ; Binner, J. ; Bradshaw, S.

Materials Science and Technology, 2002-12, Vol.18 (12), p.1419-1427 [Periódico revisado por pares]

London, England: Taylor & Francis

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10
Effects of Si on the Microstructures and Mechanical Properties of High-Chromium Cast Iron
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Effects of Si on the Microstructures and Mechanical Properties of High-Chromium Cast Iron

Lai, J. P. ; Pan, Q. L. ; Peng, H. J. ; Cui, H. R. ; Xiao, C. A.

Journal of materials engineering and performance, 2016-11, Vol.25 (11), p.4617-4623 [Periódico revisado por pares]

New York: Springer US

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