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Optical properties of excitons in ZnO-based quantum well heterostructures
Optical properties of excitons in ZnO-based quantum well heterostructures
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Optical properties of excitons in ZnO-based quantum well heterostructures

Makino, T ; Segawa, Y ; Kawasaki, M ; Koinuma, H

Semiconductor science and technology, 2005-04, Vol.20 (4), p.S78-S91 [Periódico revisado por pares]

IOP Publishing

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2
The effect of oxygen in Ru gate electrode on effective work function of Ru/HfO2 stack structure
The effect of oxygen in Ru gate electrode on effective work function of Ru/HfO2 stack structure
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The effect of oxygen in Ru gate electrode on effective work function of Ru/HfO2 stack structure

NABATAME, T ; SEGAWA, K ; KADOSHIMA, M ; TAKABA, H ; IWAMOTO, K ; KIMURA, S ; NUNOSHIGE, Y ; SATAKE, H ; OHISHI, T ; TORIUMI, Akira

Materials science in semiconductor processing, 2006-12, Vol.9 (6), p.975-979 [Periódico revisado por pares]

Oxford: Elsevier Science

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3
Realization of one-chip-two-wavelength light sources
Realization of one-chip-two-wavelength light sources
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Realization of one-chip-two-wavelength light sources

Song, J.S. ; Cho, M.W. ; Oh, D.C. ; Makino, H. ; Hanada, T. ; Zhang, B.P. ; Segawa, Y. ; Song, H.S. ; Cho, I.S. ; Chang, J.H. ; Yao, T.

Materials science in semiconductor processing, 2003-10, Vol.6 (5), p.561-565 [Periódico revisado por pares]

Elsevier Ltd

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4
New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallization
New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallization
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Ata de Congresso 		Adicionar ao Meu Espaço

New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallization

Kaori Tai ; Ohtorii, H. ; Takahashi, S. ; Komai, N. ; Horikoshi, H. ; Sato, S. ; Ohoka, Y. ; Segawa, Y. ; Ishihara, M. ; Yasuda, Z. ; Nogami, T.

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519), 2002, p.194-196

IEEE

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5
Fragile porous low-k/copper integration by using electro-chemical polishing
Fragile porous low-k/copper integration by using electro-chemical polishing
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Fragile porous low-k/copper integration by using electro-chemical polishing

Takahashi, S. ; Tai, K. ; Ohtorii, H. ; Komai, N. ; Segawa, Y. ; Horikoshi, H. ; Yasuda, Z. ; Yamada, H. ; Ishihara, M. ; Nogami, T.

2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303), 2002, p.32-33

Piscataway NJ: IEEE

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6
Fabrication of fine wiring structure by electrodeposited polyimide for high density packaging and interconnection
Fabrication of fine wiring structure by electrodeposited polyimide for high density packaging and interconnection
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Fabrication of fine wiring structure by electrodeposited polyimide for high density packaging and interconnection

Tokoro, K. ; Nakagawa, H. ; Kikuchi, K. ; Eun-Sil Jung ; Segawa, S. ; Itatani, H. ; Aoyagi, M.

4th Electronics Packaging Technology Conference, 2002, 2002, p.361-365

IEEE

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