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Optimising the Lithographic Patterning Effect in an Acid Copper Electroplating ProcessPoon, Gary K. K. ; Williams, D.J. ; Chin, K.S.International Journal of Advanced Manufacturing Technology (UK), 2000-01, Vol.16 (12), p.881-888 [Periódico revisado por pares]Heidelberg: Springer Nature B.VTexto completo disponível |