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LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults
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LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults

Ni, Tianming ; Yao, Yao ; Chang, Hao ; Lu, Lin ; Liang, Huaguo ; Yan, Aibin ; Huang, Zhengfeng ; Wen, Xiaoqing

IEEE transactions on computer-aided design of integrated circuits and systems, 2020-10, Vol.39 (10), p.2938-2951 [Periódico revisado por pares]

New York: IEEE

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2
TRAVERSAL: A Fast and Adaptive Graph-Based Placement and Routing for CGRAs
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TRAVERSAL: A Fast and Adaptive Graph-Based Placement and Routing for CGRAs

Canesche, Michael ; Menezes, Marcelo ; Carvalho, Westerley ; Torres, Frank Sill ; Jamieson, Peter ; Nacif, Jose Augusto ; Ferreira, Ricardo

IEEE transactions on computer-aided design of integrated circuits and systems, 2021-08, Vol.40 (8), p.1600-1612 [Periódico revisado por pares]

New York: IEEE

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3
GAN-OPC: Mask Optimization With Lithography-Guided Generative Adversarial Nets
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GAN-OPC: Mask Optimization With Lithography-Guided Generative Adversarial Nets

Yang, Haoyu ; Li, Shuhe ; Deng, Zihao ; Ma, Yuzhe ; Yu, Bei ; Young, Evangeline F. Y.

IEEE transactions on computer-aided design of integrated circuits and systems, 2020-10, Vol.39 (10), p.2822-2834 [Periódico revisado por pares]

New York: IEEE

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4
Risk-5: Controlled Approximations for RISC-V
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Risk-5: Controlled Approximations for RISC-V

Felzmann, Isaias ; Filho, Joao Fabricio ; Wanner, Lucas

IEEE transactions on computer-aided design of integrated circuits and systems, 2020-11, Vol.39 (11), p.4052-4063 [Periódico revisado por pares]

New York: IEEE

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5
Secure Scan and Test Using Obfuscation Throughout Supply Chain
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Secure Scan and Test Using Obfuscation Throughout Supply Chain

Wang, Xiaoxiao ; Zhang, Dongrong ; He, Miao ; Su, Donglin ; Tehranipoor, Mark

IEEE transactions on computer-aided design of integrated circuits and systems, 2018-09, Vol.37 (9), p.1867-1880 [Periódico revisado por pares]

New York: IEEE

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6
A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC
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A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC

Ni, Tianming ; Xu, Qi ; Huang, Zhengfeng ; Liang, Huaguo ; Yan, Aibin ; Wen, Xiaoqing

IEEE transactions on computer-aided design of integrated circuits and systems, 2021-09, Vol.40 (9), p.1952-1956 [Periódico revisado por pares]

New York: IEEE

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7
Fast and Correct Load-Link/Store-Conditional Instruction Handling in DBT Systems
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Fast and Correct Load-Link/Store-Conditional Instruction Handling in DBT Systems

Kristien, Martin ; Spink, Tom ; Campbell, Brian ; Sarkar, Susmit ; Stark, Ian ; Franke, Bjorn ; Bohm, Igor ; Topham, Nigel

IEEE transactions on computer-aided design of integrated circuits and systems, 2020-11, Vol.39 (11), p.3544-3554 [Periódico revisado por pares]

New York: IEEE

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8
Energy-Quality-Time Optimized Task Mapping on DVFS-Enabled Multicores
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Energy-Quality-Time Optimized Task Mapping on DVFS-Enabled Multicores

Mo, Lei ; Kritikakou, Angeliki ; Sentieys, Olivier

IEEE transactions on computer-aided design of integrated circuits and systems, 2018-11, Vol.37 (11), p.2428-2439 [Periódico revisado por pares]

New York: IEEE

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9
GAAS: An Efficient Group Associated Architecture and Scheduler Module for Sparse CNN Accelerators
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GAAS: An Efficient Group Associated Architecture and Scheduler Module for Sparse CNN Accelerators

Wang, Jingyu ; Yuan, Zhe ; Liu, Ruoyang ; Feng, Xiaoyu ; Du, Li ; Yang, Huazhong ; Liu, Yongpan

IEEE transactions on computer-aided design of integrated circuits and systems, 2020-12, Vol.39 (12), p.5170-5182 [Periódico revisado por pares]

New York: IEEE

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10
TSV Repair Architecture for Clustered Faults
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TSV Repair Architecture for Clustered Faults

Jang, Jaewon ; Cheong, Minho ; Kang, Sungho

IEEE transactions on computer-aided design of integrated circuits and systems, 2019-01, Vol.38 (1), p.190-194 [Periódico revisado por pares]

New York: IEEE

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