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Material Type: Artigo
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LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered FaultsNi, Tianming ; Yao, Yao ; Chang, Hao ; Lu, Lin ; Liang, Huaguo ; Yan, Aibin ; Huang, Zhengfeng ; Wen, XiaoqingIEEE transactions on computer-aided design of integrated circuits and systems, 2020-10, Vol.39 (10), p.2938-2951 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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TRAVERSAL: A Fast and Adaptive Graph-Based Placement and Routing for CGRAsCanesche, Michael ; Menezes, Marcelo ; Carvalho, Westerley ; Torres, Frank Sill ; Jamieson, Peter ; Nacif, Jose Augusto ; Ferreira, RicardoIEEE transactions on computer-aided design of integrated circuits and systems, 2021-08, Vol.40 (8), p.1600-1612 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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GAN-OPC: Mask Optimization With Lithography-Guided Generative Adversarial NetsYang, Haoyu ; Li, Shuhe ; Deng, Zihao ; Ma, Yuzhe ; Yu, Bei ; Young, Evangeline F. Y.IEEE transactions on computer-aided design of integrated circuits and systems, 2020-10, Vol.39 (10), p.2822-2834 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Risk-5: Controlled Approximations for RISC-VFelzmann, Isaias ; Filho, Joao Fabricio ; Wanner, LucasIEEE transactions on computer-aided design of integrated circuits and systems, 2020-11, Vol.39 (11), p.4052-4063 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Secure Scan and Test Using Obfuscation Throughout Supply ChainWang, Xiaoxiao ; Zhang, Dongrong ; He, Miao ; Su, Donglin ; Tehranipoor, MarkIEEE transactions on computer-aided design of integrated circuits and systems, 2018-09, Vol.37 (9), p.1867-1880 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D ICNi, Tianming ; Xu, Qi ; Huang, Zhengfeng ; Liang, Huaguo ; Yan, Aibin ; Wen, XiaoqingIEEE transactions on computer-aided design of integrated circuits and systems, 2021-09, Vol.40 (9), p.1952-1956 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Fast and Correct Load-Link/Store-Conditional Instruction Handling in DBT SystemsKristien, Martin ; Spink, Tom ; Campbell, Brian ; Sarkar, Susmit ; Stark, Ian ; Franke, Bjorn ; Bohm, Igor ; Topham, NigelIEEE transactions on computer-aided design of integrated circuits and systems, 2020-11, Vol.39 (11), p.3544-3554 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Energy-Quality-Time Optimized Task Mapping on DVFS-Enabled MulticoresMo, Lei ; Kritikakou, Angeliki ; Sentieys, OlivierIEEE transactions on computer-aided design of integrated circuits and systems, 2018-11, Vol.37 (11), p.2428-2439 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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GAAS: An Efficient Group Associated Architecture and Scheduler Module for Sparse CNN AcceleratorsWang, Jingyu ; Yuan, Zhe ; Liu, Ruoyang ; Feng, Xiaoyu ; Du, Li ; Yang, Huazhong ; Liu, YongpanIEEE transactions on computer-aided design of integrated circuits and systems, 2020-12, Vol.39 (12), p.5170-5182 [Periódico revisado por pares]New York: IEEETexto completo disponível |
10 |
Material Type: Artigo
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TSV Repair Architecture for Clustered FaultsJang, Jaewon ; Cheong, Minho ; Kang, SunghoIEEE transactions on computer-aided design of integrated circuits and systems, 2019-01, Vol.38 (1), p.190-194 [Periódico revisado por pares]New York: IEEETexto completo disponível |