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magazinearticle
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: magazinearticle
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Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D IntegrationSuk-Kyu Ryu ; Kuan-Hsun Lu ; Tengfei Jiang ; Jang-Hi Im ; Rui Huang ; Ho, P. S.IEEE transactions on device and materials reliability, 2012-06, Vol.12 (2), p.255-262 [Periódico revisado por pares]New York: IEEETexto completo disponível |
| 2 |
Material Type: magazinearticle
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Wet Metallization of High Aspect Ratio TSV Using Electrografted Polymer Insulator to Suppress Residual Stress in SiliconDequivre, Thomas ; Kolhatkar, Gitanjali ; Hadj Youssef, Azza ; Le, Xuan T. ; Brisard, Gessie M. ; Ruediger, Andreas ; Charlebois, Serge A.IEEE transactions on device and materials reliability, 2017-09, Vol.17 (3), p.514-521 [Periódico revisado por pares]IEEETexto completo disponível |
| 3 |
Material Type: magazinearticle
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An Effective Approach of Improving Electrical and Thermo-Mechanical Reliabilities of Through-Silicon ViasWang, Fengjuan ; Yu, NingmeiIEEE transactions on device and materials reliability, 2017-03, Vol.17 (1), p.106-112 [Periódico revisado por pares]New York: IEEETexto completo disponível |
| 4 |
Material Type: magazinearticle
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Study of Near-Surface Stresses in Silicon Around Through-Silicon Vias at Elevated Temperatures by Raman Spectroscopy and SimulationsZhu, Ye ; Zhang, Jiye ; Li, Hong Yu ; Tan, Chuan Seng ; Xia, GuangruiIEEE transactions on device and materials reliability, 2015-06, Vol.15 (2), p.142-148 [Periódico revisado por pares]IEEETexto completo disponível |
| 5 |
Material Type: magazinearticle
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Keep it upMachine design, 1995-07, Vol.67 (12), p.12Nashville: Endeavor Business MediaTexto completo disponível |
| 6 |
Material Type: magazinearticle
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Keep it upMachine design, 1994-01, Vol.66 (2), p.14Nashville: Endeavor Business MediaTexto completo disponível |
| 7 |
Material Type: magazinearticle
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Keep marchingBerman, JonathanNew scientist (1971), 2018-04, Vol.238 (3173), p.24-25London: New ScientistTexto completo disponível |
| 8 |
Material Type: magazinearticle
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MXenes Keep Getting BetterJacoby, MitchChemical & Engineering News Archive, 2015-01, Vol.93 (1), p.23-24Washington: American Chemical SocietyTexto completo disponível |
| 9 |
Material Type: magazinearticle
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Keep punchingHogan, Brian JManufacturing Engineering, 2003-03, Vol.130 (3), p.12Dearborn: SMETexto completo disponível |
| 10 |
Material Type: magazinearticle
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Keep smilingMachine design, 1995-04, Vol.67 (7), p.12Nashville: Endeavor Business MediaTexto completo disponível |
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