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Material Type: magazinearticle
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Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D IntegrationSuk-Kyu Ryu ; Kuan-Hsun Lu ; Tengfei Jiang ; Jang-Hi Im ; Rui Huang ; Ho, P. S.IEEE transactions on device and materials reliability, 2012-06, Vol.12 (2), p.255-262 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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Wet Metallization of High Aspect Ratio TSV Using Electrografted Polymer Insulator to Suppress Residual Stress in SiliconDequivre, Thomas ; Kolhatkar, Gitanjali ; Hadj Youssef, Azza ; Le, Xuan T. ; Brisard, Gessie M. ; Ruediger, Andreas ; Charlebois, Serge A.IEEE transactions on device and materials reliability, 2017-09, Vol.17 (3), p.514-521 [Periódico revisado por pares]IEEETexto completo disponível |
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Material Type: magazinearticle
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How the PCC became a global playerCrompton, SimonManaging Intellectual Property, 2013-04London: Euromoney Trading LimitedTexto completo disponível |
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Material Type: magazinearticle
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Keep Your AI Projects on TrackBojinov, IavorHarvard business review, 2023-11Boston: Harvard Business ReviewTexto completo disponível |
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5 |
Material Type: magazinearticle
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An Effective Approach of Improving Electrical and Thermo-Mechanical Reliabilities of Through-Silicon ViasWang, Fengjuan ; Yu, NingmeiIEEE transactions on device and materials reliability, 2017-03, Vol.17 (1), p.106-112 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: magazinearticle
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UNAPREÐENJE KONCEPTA PODRIJETLA MARKE PUTEM OBRNUTOG UČINKA ZEMLJE PODRIJETLA: SLUČAJ GENERACIJE ZVranešević, Tihomir ; Pušić, Ana ; Mandić, MiroslavEkonomski pregled, 2024-01, Vol.75 (1), p.32Zagreb: Hrvatsko Drustvo EkonomistaTexto completo disponível |
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7 |
Material Type: magazinearticle
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Study of Near-Surface Stresses in Silicon Around Through-Silicon Vias at Elevated Temperatures by Raman Spectroscopy and SimulationsZhu, Ye ; Zhang, Jiye ; Li, Hong Yu ; Tan, Chuan Seng ; Xia, GuangruiIEEE transactions on device and materials reliability, 2015-06, Vol.15 (2), p.142-148 [Periódico revisado por pares]IEEETexto completo disponível |
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Material Type: magazinearticle
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China's Investment Environment Keeps Improving北京周报:英文版, 2017, Vol.60 (27), p.34-34Texto completo disponível |
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Material Type: magazinearticle
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Keep It Up, On SafariWeir, RobSing out, 2005-03, Vol.49 (1), p.157Sing Out CorporationTexto completo disponível |
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10 |
Material Type: magazinearticle
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Sun keeps its foot in Java's door; Could Microsoft's COOL unseat the language?Brody, StevenJava world, 1999-04, p.1San Francisco: FoundryTexto completo disponível |