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Computational intelligence an introduction
Computational intelligence an introduction
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Computational intelligence an introduction

Andries P Engelbrecht

Chichester, West Sussex, England J. Wiley Hoboken, NJ c2007

Acesso online. A biblioteca também possui exemplares impressos.

2
Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys
Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys
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Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

Efzan Mhd Noor, Ervina ; Singh, Amares

Soldering & surface mount technology, 2014-05, Vol.26 (3), p.147-161 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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3
Electroluminescent structures printed on paper and textile elastic substrates
Electroluminescent structures printed on paper and textile elastic substrates
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Electroluminescent structures printed on paper and textile elastic substrates

Sloma, Marcin ; Janczak, Daniel ; Wroblewski, Grzegorz ; Mlozniak, Anna ; Jakubowska, Malgorzata Agata Skwarek, Dr

Circuit world, 2014-01, Vol.40 (1), p.13-16 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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4
Fundamental characteristics and first prototype of a novel claw pole type half-wave rectified variable field flux motor
Fundamental characteristics and first prototype of a novel claw pole type half-wave rectified variable field flux motor
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Fundamental characteristics and first prototype of a novel claw pole type half-wave rectified variable field flux motor

Abe, Takashi ; Ohba, Ryohei ; Higuchi, Tsuyoshi Zhu, Z.Q.

Compel, 2016-03, Vol.35 (2), p.407-423 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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5
Research and prospect of binary high-temperature Pb-free solders
Research and prospect of binary high-temperature Pb-free solders
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Research and prospect of binary high-temperature Pb-free solders

Du, Yunfei ; Li, Chuntian ; Huang, Bin ; Tang, Ming ; Du, Changhua

Soldering & surface mount technology, 2015-02, Vol.27 (1), p.7-12 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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6
Topology optimization of rotor poles in a permanent-magnet machine using level set method and continuum design sensitivity analysis
Topology optimization of rotor poles in a permanent-magnet machine using level set method and continuum design sensitivity analysis
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Topology optimization of rotor poles in a permanent-magnet machine using level set method and continuum design sensitivity analysis

Putek, Piotr ; Paplicki, Piotr ; Pałka, Ryszard Luc Dupré and Dr Guillaume Crevecoeur, Professor

Compel, 2014-04, Vol.33 (3), p.711-728 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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7
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering
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Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering

Geczy, Attila ; Fejos, Márta ; Tersztyánszky, László

Soldering & surface mount technology, 2015-04, Vol.27 (2), p.61-68 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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8
Surface analysis of polymeric substrates used for inkjet printing technology
Surface analysis of polymeric substrates used for inkjet printing technology
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Surface analysis of polymeric substrates used for inkjet printing technology

Pietrikova, Alena ; Lukacs, Peter ; Jakubeczyova, Dagmar ; Ballokova, Beata ; Potencki, Jerzy ; Tomaszewski, Grzegorz ; Pekarek, Jan ; Prikrylova, Katerina ; Fides, Martin

Circuit world, 2016-02, Vol.42 (1), p.9-16 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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9
Thermal and mechanical properties of sintered Ag layers for power module assembly
Thermal and mechanical properties of sintered Ag layers for power module assembly
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Thermal and mechanical properties of sintered Ag layers for power module assembly

Myśliwiec, Marcin ; Kisiel, Ryszard

Microelectronics international, 2015-01, Vol.32 (1), p.37-42

Bradford: Emerald Group Publishing Limited

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10
Parallelized ICCG method using block-multicolor orderings in real symmetric linear system derived from voltage-driven FEM in time domain
Parallelized ICCG method using block-multicolor orderings in real symmetric linear system derived from voltage-driven FEM in time domain
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Parallelized ICCG method using block-multicolor orderings in real symmetric linear system derived from voltage-driven FEM in time domain

Tsuburaya, Tomonori ; Okamoto, Yoshifumi ; Sato, Shuji Oszkár Bíró, Professor David A. Low, Professor

Compel, 2015-09, Vol.34 (5), p.1433-1446 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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Deste Autor:

  1. Engelbrecht, A

Neste Assunto:

  1. Electrical & Electronic Engineering
  2. Electrical & Electronic Engineering
  3. Engineering
  4. Technology
  5. Science & Technology

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