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3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating
3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating
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3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating

Killge, Sebastian ; Bartusseck, Irene ; Junige, Marcel ; Neumann, Volker ; Reif, Johanna ; Wenzel, Christian ; Böttcher, Mathias ; Albert, Matthias ; Jürgen Wolf, M. ; Bartha, Johann W.

Microelectronic engineering, 2019-01, Vol.205, p.20-25 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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2
Halide-Free Synthesis and Tribological Performance of Oil-Miscible Ammonium and Phosphonium-Based Ionic Liquids
Halide-Free Synthesis and Tribological Performance of Oil-Miscible Ammonium and Phosphonium-Based Ionic Liquids
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Halide-Free Synthesis and Tribological Performance of Oil-Miscible Ammonium and Phosphonium-Based Ionic Liquids

Westerholt, A ; Weschta, M ; Bösmann, A ; Tremmel, S ; Korth, Y ; Wolf, M ; Schlücker, E ; Wehrum, N ; Lennert, A ; Uerdingen, M ; Holweger, W ; Wartzack, S ; Wasserscheid, P

ACS sustainable chemistry & engineering, 2015-05, Vol.3 (5), p.797-808 [Periódico revisado por pares]

American Chemical Society

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3
Laser ablation and injection moulding as techniques for producing micro channels compatible with Small Angle X-Ray Scattering
Laser ablation and injection moulding as techniques for producing micro channels compatible with Small Angle X-Ray Scattering
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Laser ablation and injection moulding as techniques for producing micro channels compatible with Small Angle X-Ray Scattering

Haider, R. ; Marmiroli, B. ; Gavalas, I. ; Wolf, M. ; Matteucci, M. ; Taboryski, R. ; Boisen, A. ; Stratakis, E. ; Amenitsch, H.

Microelectronic engineering, 2018-08, Vol.195, p.7-12 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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4
Electrical and structural properties of ultrathin SiON films on Si prepared by plasma nitridation
Electrical and structural properties of ultrathin SiON films on Si prepared by plasma nitridation
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Electrical and structural properties of ultrathin SiON films on Si prepared by plasma nitridation

Hourdakis, E. ; Nassiopoulou, A. G. ; Parisini, A. ; Reading, M. A. ; van den Berg, J. A. ; Sygellou, L. ; Ladas, S. ; Petrik, P. ; Nutsch, A. ; Wolf, M. ; Roeder, G.

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2011-03, Vol.29 (2) [Periódico revisado por pares]

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5
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques
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Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques

Wolf, M. ; Sukumaran Nair, A. ; Hoffrogge, P. ; Kühnicke, E. ; Czurratis, P.

Microelectronics and reliability, 2022-11, Vol.138, p.114618, Article 114618 [Periódico revisado por pares]

Elsevier Ltd

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6
Ultrafast far-infrared optics of carbon nanotubes
Ultrafast far-infrared optics of carbon nanotubes
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Ultrafast far-infrared optics of carbon nanotubes

Frischkorn, C ; Kampfrath, T ; Perfetti, L ; von Volkmann, K ; Wolf, M

Proceedings of SPIE, the International Society for Optical Engineering, 2009, Vol.7214, p.72140A-72140A-9

Bellingham, Wash: SPIE

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7
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
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Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking

Panchenko, Iuliana ; Wolter, Klaus-Juergen ; Croes, Kristof ; De Wolf, Ingrid ; De Messemaeker, Joke ; Beyne, Eric ; Wolf, M. Juergen

Microelectronics and reliability, 2019-11, Vol.102, p.113296, Article 113296 [Periódico revisado por pares]

Elsevier Ltd

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8
Extreme THz nonlinearities in bulk and nanostructured semiconductors
Extreme THz nonlinearities in bulk and nanostructured semiconductors
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Extreme THz nonlinearities in bulk and nanostructured semiconductors

Sell, A ; Anappara, A. A ; Kampfrath, T ; von Volkmann, K ; Wolf, M ; Steiner, J. T ; Kira, M ; Koch, S. W ; Biasiol, G ; Sorba, L ; Tredicucci, A ; Leitenstorfer, A ; Huber, R

Proceedings of SPIE, the International Society for Optical Engineering, 2010, Vol.7600, p.76001S-76001S-8

Bellingham, Wash: SPIE

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9
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs
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Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs

Fregolent, M. ; Boito, M. ; Marcuzzi, A. ; De Santi, C. ; Chiocchetta, F. ; Treidel, E. Bahat ; Wolf, M. ; Brunner, F. ; Hilt, O. ; Würfl, J. ; Meneghesso, G. ; Zanoni, E. ; Meneghini, M.

Microelectronics and reliability, 2022-11, Vol.138, p.114644, Article 114644 [Periódico revisado por pares]

Elsevier Ltd

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10
Characterization of self-assembled monolayers for Cu Cu bonding technology
Characterization of self-assembled monolayers for Cu Cu bonding technology
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Characterization of self-assembled monolayers for Cu Cu bonding technology

Lykova, M. ; Langer, E. ; Hinrichs, K. ; Panchenko, I. ; Meyer, J. ; Künzelmann, U. ; Wolf, M.J. ; Lang, K.D.

Microelectronic engineering, 2018-12, Vol.202, p.19-24 [Periódico revisado por pares]

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