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1
Cu pumping in TSVs: Effect of pre-CMP thermal budget
Cu pumping in TSVs: Effect of pre-CMP thermal budget
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Cu pumping in TSVs: Effect of pre-CMP thermal budget

De Wolf, I. ; Croes, K. ; Varela Pedreira, O. ; Labie, R. ; Redolfi, A. ; Van De Peer, M. ; Vanstreels, K. ; Okoro, C. ; Vandevelde, B. ; Beyne, E.

Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1856-1859 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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2
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
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Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling

Vandevelde, Bart ; Ivankovic, A. ; Debecker, B. ; Lofrano, M. ; Vanstreels, K. ; Guo, W. ; Cherman, V. ; Gonzalez, M. ; Van der Plas, G. ; De Wolf, I. ; Beyne, E. ; Tokei, Z.

Microelectronics and reliability, 2014-06, Vol.54 (6-7), p.1200-1205 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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3
A novel method to measure the internal pressure of MEMS thin-film packages
A novel method to measure the internal pressure of MEMS thin-film packages
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A novel method to measure the internal pressure of MEMS thin-film packages

Wang, B. ; De Coster, J. ; Wevers, M. ; De Wolf, I.

Microelectronics and reliability, 2013-09, Vol.53 (9-11), p.1663-1666 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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4
Sn whisker evaluations in 3D microbumped structures
Sn whisker evaluations in 3D microbumped structures
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Sn whisker evaluations in 3D microbumped structures

Vakanas, G.P. ; Vandecasteele, B. ; Schaubroek, D. ; De Messemaeker, J. ; Willems, G. ; Ashworth, M.A. ; Wilcox, G.D. ; De Wolf, I.

Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.1982-1987 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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5
11-Megapixel CMOS-Integrated SiGe Micromirror Arrays for High-End Applications
11-Megapixel CMOS-Integrated SiGe Micromirror Arrays for High-End Applications
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11-Megapixel CMOS-Integrated SiGe Micromirror Arrays for High-End Applications

Witvrouw, A. ; Haspeslagh, L. ; Pedreira, O.V. ; De Coster, J. ; De Wolf, I. ; Tilmans, H.A.C. ; Bearda, T. ; Schlatmann, B. ; van Bommel, M. ; de Nooijer, M.-C. ; Magnee, P.H.C. ; Lous, E.J. ; Hagting, M. ; Lauria, J. ; Vanneer, R. ; van Drieenhuizen, B.

Journal of microelectromechanical systems, 2010-02, Vol.19 (1), p.202-214 [Periódico revisado por pares]

New York, NY: IEEE

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6
Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
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Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

Wang, B. ; Tanaka, S. ; Guo, B. ; Vereecke, G. ; Severi, S. ; Witvrouw, A. ; Wevers, M. ; De Wolf, I.

Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1878-1881 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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7
Simulation of TaNx deposition by Reactive PVD
Simulation of TaNx deposition by Reactive PVD
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Simulation of TaNx deposition by Reactive PVD

WOLF, H ; STREITER, R ; FRIEDEMANN, M ; BELSKY, P ; BAKAEVA, O ; LETZ, T ; GESSNER, T

Microelectronic engineering, 2010-10, Vol.87 (10), p.1907-1913 [Periódico revisado por pares]

Amsterdam: Elsevier

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8
Characterization and failure analysis of MEMS: High resolution optical investigation of small out-of-plane movements and fast vibrations
Characterization and failure analysis of MEMS: High resolution optical investigation of small out-of-plane movements and fast vibrations
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Characterization and failure analysis of MEMS: High resolution optical investigation of small out-of-plane movements and fast vibrations

VAN SPENGEN, W. Merlijn ; PUERS, R ; MERTENS, R ; DE WOLF, Ingrid

Microsystem technologies : sensors, actuators, systems integration, 2004, Vol.10 (2), p.89-96 [Periódico revisado por pares]

Berlin: Springer

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9
100 nm half-pitch double exposure KrF lithography using binary masks
100 nm half-pitch double exposure KrF lithography using binary masks
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100 nm half-pitch double exposure KrF lithography using binary masks

Geisler, S ; Bauer, J ; Haak, U ; Stolarek, D ; Schulz, K ; Wolf, H ; Meier, W ; Trojahn, M ; Matthus, E

Proceedings of SPIE, the International Society for Optical Engineering, 2008, Vol.6924, p.69241Z-69241Z-8

Bellingham, Wash: SPIE

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10
40 keV shaped electron beam lithography for LIGA intermediate mask fabrication
40 keV shaped electron beam lithography for LIGA intermediate mask fabrication
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40 keV shaped electron beam lithography for LIGA intermediate mask fabrication

Lüttge, R. ; Adam, D. ; Burkhardt, F. ; Hoke, F. ; Schacke, H. ; Schmidt, M. ; Wolf, H. ; Schmidt, A.

Microelectronic engineering, 1999, Vol.46 (1), p.247-250 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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