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Material Type: Ata de Congresso
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Potential-dependence of additives distribution in copper electrodeposition via fillingChen, Zhipeng ; Luo, Wei ; Zhu, Ying ; Li, Ming ; Gao, Liming2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.172-176IEEESem texto completo |
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Material Type: Ata de Congresso
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Concentrations of Nicotinamide in Plasma by RP-HPLC With Fluorescence DetectionPan, Zhipeng ; Li, Da ; Yao, Xiaokun ; Zhou, Shisheng ; Lun, Yongzhi Hamouda, S.A. ; Yu, Z. ; Mirzaei, M.MATEC Web of Conferences, 2016, Vol.61, p.6015 [Periódico revisado por pares]Les Ulis: EDP SciencesTexto completo disponível |
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Material Type: Ata de Congresso
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Application of Inverse Heat Conduction Problems in the Slab Solidification ProcessYu, Yang ; Luo, Xiao Chuan ; Wang, YuanApplied Mechanics and Materials, 2013, Vol.395-396, p.1135-1141 [Periódico revisado por pares]Zurich: Trans Tech Publications LtdSem texto completo |
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Material Type: Ata de Congresso
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Research on the Mechanical Properties of Frame Structure Staircase Setting Isolation BearingLiu, Xiao ; Bai, Liang ; Xin, Li Liu, T.Y. ; Tian, M. ; Li, J.Y. ; Deng, T.MATEC Web of Conferences, 2015, Vol.22, p.4002 [Periódico revisado por pares]Les Ulis: EDP SciencesTexto completo disponível |