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1
Study of Internal Stress in Conductive and Dielectric Thick Films
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Study of Internal Stress in Conductive and Dielectric Thick Films

Hlina, Jiri ; Reboun, Jan ; Janda, Martin ; Hamacek, Ales

Materials, 2022-12, Vol.15 (23), p.8686 [Periódico revisado por pares]

Switzerland: MDPI AG

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Experimental and Numerical Study of Viscoelastic Properties of Polymeric Interlayers Used for Laminated Glass: Determination of Material Parameters
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Experimental and Numerical Study of Viscoelastic Properties of Polymeric Interlayers Used for Laminated Glass: Determination of Material Parameters

Hána, Tomáš ; Janda, Tomáš ; Schmidt, Jaroslav ; Zemanová, Alena ; Šejnoha, Michal ; Eliášová, Martina ; Vokáč, Miroslav

Materials, 2019-07, Vol.12 (14), p.2241 [Periódico revisado por pares]

Switzerland: MDPI AG

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3
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper
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Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper

Hlina, Jiri ; Reboun, Jan ; Simonovsky, Marek ; Syrovy, Tomas ; Janda, Martin ; Hamacek, Ales

Materials, 2022-02, Vol.15 (4), p.1372 [Periódico revisado por pares]

Switzerland: MDPI AG

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4
The Safety of Fluoride Compounds and Their Effect on the Human Body-A Narrative Review
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The Safety of Fluoride Compounds and Their Effect on the Human Body-A Narrative Review

Lubojanski, Adam ; Piesiak-Panczyszyn, Dagmara ; Zakrzewski, Wojciech ; Dobrzynski, Wojciech ; Szymonowicz, Maria ; Rybak, Zbigniew ; Mielan, Bartosz ; Wiglusz, Rafal J ; Watras, Adam ; Dobrzynski, Maciej

Materials, 2023-01, Vol.16 (3), p.1242 [Periódico revisado por pares]

Switzerland: MDPI AG

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5
Review: The Calibration of DEM Parameters for the Bulk Modelling of Cohesive Materials
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Review: The Calibration of DEM Parameters for the Bulk Modelling of Cohesive Materials

Coetzee, Corné J. ; Scheffler, Otto C.

Processes, 2023-01, Vol.11 (1), p.5 [Periódico revisado por pares]

Basel: MDPI AG

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6
Preliminary In Vitro Study of Fluoride Release from Selected Ormocer Materials
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Preliminary In Vitro Study of Fluoride Release from Selected Ormocer Materials

Kosior, Piotr ; Dobrzynski, Maciej ; Zakrzewska, Aneta ; Grosman, Lukasz ; Korczynski, Mariusz ; Blicharski, Tomasz ; Gutbier, Martina ; Watras, Adam ; Wiglusz, Rafal J

Materials, 2021-04, Vol.14 (9), p.2244 [Periódico revisado por pares]

Switzerland: MDPI AG

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7
Quantum Solvation of Carbonyl Sulfide with Helium Atoms
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Quantum Solvation of Carbonyl Sulfide with Helium Atoms

Tang, Jian ; Xu, Yunjie ; McKellar, A. R. W. ; Jäger, Wolfgang

Science (American Association for the Advancement of Science), 2002-09, Vol.297 (5589), p.2030-2033 [Periódico revisado por pares]

Washington, DC: American Association for the Advancement of Science

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8
Minimum Radiant Exposure and Irradiance for Triggering Adequate Polymerization of a Photo-Polymerized Resin Cement
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Minimum Radiant Exposure and Irradiance for Triggering Adequate Polymerization of a Photo-Polymerized Resin Cement

Li, Qi ; Lin, Hong-Lei ; Zheng, Ming ; Ozcan, Mutlu ; Yu, Hao

Materials, 2021-04, Vol.14 (9), p.2341 [Periódico revisado por pares]

Switzerland: MDPI AG

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9
Comparative Shear-Bond Strength of Six Dental Self-Adhesive Resin Cements to Zirconia
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Comparative Shear-Bond Strength of Six Dental Self-Adhesive Resin Cements to Zirconia

Lee, Si-Eun ; Bae, Ji-Hyeon ; Choi, Jae-Won ; Jeon, Yong-Chan ; Jeong, Chang-Mo ; Yoon, Mi-Jung ; Huh, Jung-Bo

Materials, 2015-06, Vol.8 (6), p.3306-3315 [Periódico revisado por pares]

Basel: MDPI AG

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10
Plasmon Effect of Ag Nanoparticles on TiO2/rGO Nanostructures for Enhanced Energy Harvesting and Environmental Remediation
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Plasmon Effect of Ag Nanoparticles on TiO2/rGO Nanostructures for Enhanced Energy Harvesting and Environmental Remediation

Athithya, Seenidurai ; Manikandan, Valparai Surangani ; Harish, Santhana Krishnan ; Silambarasan, Kuppusamy ; Gopalakrishnan, Shanmugam ; Ikeda, Hiroya ; Navaneethan, Mani ; Archana, Jayaram

Nanomaterials (Basel, Switzerland), 2023-01, Vol.13 (1), p.65 [Periódico revisado por pares]

Basel: MDPI AG

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