Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Outros
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Improved sustainability for Nylon 11 laser sintering material: Presentation held at 30th Annual Education and Training Conference; Additive Manufacturing, 08.-12. April 2018, St. LouisGrießbach, Sören ; Sauerstein, Tobias ; Kausch, Martin2018Texto completo disponível |
2 |
Material Type: Outros
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Bimodal, Thin Wick Structures for High Heat Flux Two-Phase Thermal Control SystemsAlbu, Nathan ; Keese, Jacob ; Hwang, Gisuk49th International Conference on Environmental Systems 2019Texto completo disponível |
3 |
Material Type: Outros
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FAST/Flash: A combination of FAST/SPS and flash sintering: Presentation held at Journées Nationales sur le Frittage par Courant Pulsé - SPS 2017, Villetaneuse, 5.-6.10.2017Räthel, Jan ; Herrmann, Mathias ; Hennicke, Jürgen ; Kirchner, René2017Texto completo disponível |
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Material Type: Outros
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Mars Manufacturing SettlementMackenzie, Bruce ; Lutz, Kolemann ; Petrov, Georgi ; Leahy, Bart ; Feldman, Stuart50th International Conference on Environmental Systems 2021Texto completo disponível |
5 |
Material Type: Outros
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Progress on 3D Printed Loop Heat PipesGupta, Rohit ; Chen, Chien-Hua ; Anderson, William50th International Conference on Environmental Systems 2021Texto completo disponível |
6 |
Material Type: Outros
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FAST/SPS - principle, possibilities and applications: Presentation held at the Workshop FAST/SPS, 2013, St. PetersburgRäthel, Jan ; Herrmann, Mathias ; Beckert, Wieland ; Schöne, Jakob2013Texto completo disponível |
7 |
Material Type: Outros
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Implementierung eines Sintermodells in ANSYS: Vortrag gehalten auf der 35. CADFEM ANSYS Simulation Conference, Koblenz, 15.-17.11.2017Stark, Sebastian ; Neumeister, Peter2017Texto completo disponível |
8 |
Material Type: Outros
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Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out: Presentation held at Schweizer Electronic Power and Radar PCB Summit 27./28.06.2018Schletz, Andreas2018Texto completo disponível |
9 |
Material Type: Outros
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Power electronics packaging at Fraunhofer IISB: Presentation held at SEMICON West 2018, July 10-12, 2018, San Francisco, CaliforniaBayer, Christoph F2018Texto completo disponível |
10 |
Material Type: Outros
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Loop Heat Pipe Wick Fabrication via Additive ManufacturingRichard, Bradley ; Anderson, William ; Pellicone, Devin48th International Conference on Environmental Systems 2018Texto completo disponível |