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Multitechnology Biofabrication: A New Approach for the Manufacturing of Functional Tissue Structures?
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Multitechnology Biofabrication: A New Approach for the Manufacturing of Functional Tissue Structures?

Castilho, Miguel ; de Ruijter, Mylène ; Beirne, Stephen ; Villette, Claire C. ; Ito, Keita ; Wallace, Gordon G. ; Malda, Jos

Trends in biotechnology (Regular ed.), 2020-12, Vol.38 (12), p.1316-1328 [Revista revisada por pares]

England: Elsevier Ltd

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Digital 3D design as a tool for augmenting zero-waste fashion design practice
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Digital 3D design as a tool for augmenting zero-waste fashion design practice

McQuillan, Holly

International journal of fashion design, technology and education, 2020-01, Vol.13 (1), p.89-100 [Revista revisada por pares]

Abingdon: Taylor & Francis

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Fashion and game design as hybrid practices: approaches in education to creating fashion-related experiences in digital worlds
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Fashion and game design as hybrid practices: approaches in education to creating fashion-related experiences in digital worlds

Tepe, Jan ; Koohnavard, Saina

International journal of fashion design, technology and education, 2023-01, Vol.16 (1), p.37-45 [Revista revisada por pares]

Abingdon: Taylor & Francis

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4
Market orientation, restructuring and collaboration: The impact of digital design on organizational competitiveness
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Market orientation, restructuring and collaboration: The impact of digital design on organizational competitiveness

Dabić, Marina ; Stojčić, Nebojša ; Afawubo, Komivi ; Chouki, Mourad ; Huck, Nicolas

Creativity and innovation management, 2023-09, Vol.32 (3), p.425-441 [Revista revisada por pares]

Oxford: Blackwell Publishing Ltd

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5
Radiation-Hardened Cortex-R4F System-on-Chip Prototype With Total Ionizing Dose Dynamic Compensation in 28-nm FD-SOI
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Radiation-Hardened Cortex-R4F System-on-Chip Prototype With Total Ionizing Dose Dynamic Compensation in 28-nm FD-SOI

Abouzeid, Fady ; de Boissac, Capucine Lecat-Mathieu ; Malherbe, Victor ; Daveau, Jean-Marc ; Asquini, Anna ; Bertin, Valerie ; De-Paoli, Serge ; Gasiot, Gilles ; Timineri, Calogero ; Autran, Jean-Luc ; Roche, Philippe

IEEE transactions on nuclear science, 2021-05, Vol.68 (5), p.1040-1044 [Revista revisada por pares]

New York: IEEE

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On-Chip Total Ionizing Dose Digital Monitor in Fully Depleted SOI Technologies
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On-Chip Total Ionizing Dose Digital Monitor in Fully Depleted SOI Technologies

Abouzeid, Fady ; Gasiot, Gilles ; Soussan, Dimitri ; de Boissac, Capucine Lecat-Mathieu ; Malherbe, Victor ; Bertin, Valerie ; Lallement, Guenole ; Autran, Jean-Luc ; Roche, Philippe

IEEE transactions on nuclear science, 2020-07, Vol.67 (7), p.1326-1331 [Revista revisada por pares]

New York: IEEE

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7
Design in 3D: a computational fashion design protocol
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Design in 3D: a computational fashion design protocol

Greder, Katherine Celia ; Pei, Jie ; Shin, Jooyoung

International journal of clothing science and technology, 2020-08, Vol.32 (4), p.537-549 [Revista revisada por pares]

Bradford: Emerald Publishing Limited

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8
Reliability enhancement of a steep slope tunnel transistor based ring oscillator designs with circuit interaction
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Reliability enhancement of a steep slope tunnel transistor based ring oscillator designs with circuit interaction

Japa, Aditya ; Vallabhaneni, Harshita ; Vaddi, Ramesh

IET circuits, devices & systems, 2016-11, Vol.10 (6), p.522-527 [Revista revisada por pares]

The Institution of Engineering and Technology

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9
A Review of Algorithms and Hardware Implementations for Spiking Neural Networks
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A Review of Algorithms and Hardware Implementations for Spiking Neural Networks

Nguyen, Duy-Anh ; Tran, Xuan-Tu ; Iacopi, Francesca

Journal of low power electronics and applications, 2021-06, Vol.11 (2), p.23 [Revista revisada por pares]

Basel: MDPI AG

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Unification of scheduling, binding, and retiming to reduce power consumption under timings and resources constraints
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Unification of scheduling, binding, and retiming to reduce power consumption under timings and resources constraints

Chabini, N. ; Wolf, W.

IEEE transactions on very large scale integration (VLSI) systems, 2005-10, Vol.13 (10), p.1113-1126 [Revista revisada por pares]

Piscataway, NJ: IEEE

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