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Vertically high-density interconnection for mobile application
Vertically high-density interconnection for mobile application
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Vertically high-density interconnection for mobile application

Katahira, Takayoshi ; Kartio, Ilkka ; Segawa, Hiroshi ; Takahashi, Michimasa ; Sagisaka, Katsumi

Microelectronics and reliability, 2006-05, Vol.46 (5), p.756-762 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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Efficient fabrication process for superconducting integrated circuits using photosensitive polyimide insulation layers
Efficient fabrication process for superconducting integrated circuits using photosensitive polyimide insulation layers
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Efficient fabrication process for superconducting integrated circuits using photosensitive polyimide insulation layers

Kikuchi, K. ; Goto, M. ; Nakagawa, H. ; Segawa, S. ; Tokoro, K. ; Taino, T. ; Myoren, H. ; Takada, S. ; Aoyagi, M.

IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.94-97 [Periódico revisado por pares]

New York, NY: IEEE

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3
New fabrication process for Josephson tunnel junctions using photosensitive polyimide insulation layer for superconducting integrated circuits
New fabrication process for Josephson tunnel junctions using photosensitive polyimide insulation layer for superconducting integrated circuits
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New fabrication process for Josephson tunnel junctions using photosensitive polyimide insulation layer for superconducting integrated circuits

Kikuchi, K. ; Segawa, S. ; Eun-Sil Jung ; Nakagawa, H. ; Tokoro, K. ; Itatani, H. ; Aoyagi, M.

IEEE transactions on applied superconductivity, 2003-06, Vol.13 (2), p.119-122 [Periódico revisado por pares]

New York, NY: IEEE

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4
Interlayer dielectric process for LSI circuits using positive photosensitive polyimide synthesized by block-copolymerization
Interlayer dielectric process for LSI circuits using positive photosensitive polyimide synthesized by block-copolymerization
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Interlayer dielectric process for LSI circuits using positive photosensitive polyimide synthesized by block-copolymerization

Aoyagi, Masahiro ; Segawa, Shigemasa ; Jung, EunSil ; Itatani, Taro ; Komuro, Masanori ; Sakamoto, Tsuenenori ; Itatani, Hiroshi ; Miyamura, Masataka ; Matsumoto, Shunichi

SPIE proceedings series, 2001, Vol.4345, p.1073-1078

Bellingham WA: SPIE

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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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