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Refinado por: Base de dados/Biblioteca: Copper Technical Reference Library remover Nome da Publicação: Engineering Fracture Mechanics remover
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1
Fatigue crack growth resistance of ECAPed ultrafine-grained copper
Fatigue crack growth resistance of ECAPed ultrafine-grained copper
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Fatigue crack growth resistance of ECAPed ultrafine-grained copper

Collini, Luca

Engineering fracture mechanics, 2010-04, Vol.77 (6), p.1001-1011 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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2
Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components
Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components
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Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components

Yan, Yabin ; Sumigawa, Takashi ; Shang, Fulin ; Kitamura, Takayuki

Engineering fracture mechanics, 2011-12, Vol.78 (17), p.2935-2946 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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3
Stress analysis around a through crack shaped void in a single crystal copper strip coated on an infinitely stiff material using molecular dynamics
Stress analysis around a through crack shaped void in a single crystal copper strip coated on an infinitely stiff material using molecular dynamics
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Stress analysis around a through crack shaped void in a single crystal copper strip coated on an infinitely stiff material using molecular dynamics

Johansson, D. ; Hansson, P. ; Melin, S.

Engineering fracture mechanics, 2014-01, Vol.116, p.58-68 [Periódico revisado por pares]

Elsevier Ltd

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4
Fatigue and fracture parameters of diffusion alloyed Cu–Ni–Mo sintered steel
Fatigue and fracture parameters of diffusion alloyed Cu–Ni–Mo sintered steel
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Fatigue and fracture parameters of diffusion alloyed Cu–Ni–Mo sintered steel

Šori, M. ; Vuherer, T. ; Glodež, S.

Engineering fracture mechanics, 2016-03, Vol.153, p.278-288 [Periódico revisado por pares]

Elsevier Ltd

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5
Influence of the crystallographic orientation and thickness of thin copper coatings during nanoindentation
Influence of the crystallographic orientation and thickness of thin copper coatings during nanoindentation
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Influence of the crystallographic orientation and thickness of thin copper coatings during nanoindentation

Hansson, Per

Engineering fracture mechanics, 2015-12, Vol.150, p.143-152 [Periódico revisado por pares]

Elsevier Ltd

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6
Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field
Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field
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Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field

Kawai, Emi ; Sanada, Kazunori ; Sumigawa, Takashi ; Kitamura, Takayuki

Engineering fracture mechanics, 2014-04, Vol.120, p.60-66 [Periódico revisado por pares]

Elsevier Ltd

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7
Stress and displacement configurations in the vicinity of a void in a nanometer copper strip
Stress and displacement configurations in the vicinity of a void in a nanometer copper strip
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Stress and displacement configurations in the vicinity of a void in a nanometer copper strip

Johansson, Dan ; Hansson, Per ; Melin, Solveig

Engineering fracture mechanics, 2016-02, Vol.152, p.139-146 [Periódico revisado por pares]

Elsevier Ltd

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8
Initial dislocation topologies of nanoindentation into copper (0 0 1) film with a nanocavity
Initial dislocation topologies of nanoindentation into copper (0 0 1) film with a nanocavity
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Initial dislocation topologies of nanoindentation into copper (0 0 1) film with a nanocavity

Yu, Wenshan ; Shen, Shengping

Engineering fracture mechanics, 2010-11, Vol.77 (16), p.3329-3340 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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9
High-cycle fatigue strength and small-crack growth behavior of ultrafine-grained copper with post-ECAP annealing
High-cycle fatigue strength and small-crack growth behavior of ultrafine-grained copper with post-ECAP annealing
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High-cycle fatigue strength and small-crack growth behavior of ultrafine-grained copper with post-ECAP annealing

Goto, M. ; Teshima, N. ; Han, S.Z. ; Euh, K. ; Yakushiji, T. ; Kim, S.S. ; Lee, J.

Engineering fracture mechanics, 2013-09, Vol.110, p.218-232 [Periódico revisado por pares]

Elsevier Ltd

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10
Multiscale modelling of nanoindentation test in copper crystal
Multiscale modelling of nanoindentation test in copper crystal
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Multiscale modelling of nanoindentation test in copper crystal

Horníková, Jana ; Šandera, Pavel ; Černý, Miroslav ; Pokluda, Jaroslav

Engineering fracture mechanics, 2008-08, Vol.75 (12), p.3755-3762 [Periódico revisado por pares]

Elsevier Ltd

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