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Material Type: Acta de Congreso
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Direct copper electrodeposition on a chemical vapor-deposited ruthenium seed layer for through-silicon viasPing Shi ; Enloe, J. ; van den Boom, R. ; Sapp, B.2012 IEEE International Interconnect Technology Conference, 2012, p.1-3IEEETexto completo disponible |
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Material Type: Acta de Congreso
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Evolving a rapid prototyping environment for visually and analytically exploring large-scale Linked Open DataDownie, M. ; Kaiser, P. ; Enloe, D. ; Fox, P. ; Hendler, J. ; Ameres, E. ; Goebel, J.2011 IEEE Symposium on Large Data Analysis and Visualization, 2011, p.139-140IEEETexto completo disponible |
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Material Type: Acta de Congreso
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Measurement and simulation of high voltage-wake interactionsCooke, D.L. ; Pakula, W. ; Davis, V.A. ; Mandell, M.J. ; Tautz, M. ; Enloe, C.L.IEEE Conference Record - Abstracts. 1996 IEEE International Conference on Plasma Science, 1996, p.242IEEETexto completo disponible |
4 |
Material Type: Acta de Congreso
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High resolution retarding field analyserJohnson, S.D. ; El-Gomati, M.M. ; Mahadevan, J. ; Enloe, L.IVMC 2001. Proceedings of the 14th International Vacuum Microelectronics Conference (Cat. No.01TH8586), 2001, p.11-12IEEETexto completo disponible |
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Material Type: Acta de Congreso
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Preflight predictions of high voltage - ion collection of the charge hazard and wake studies experimentCooke, D.L. ; Biasca, R. ; Enloe, C. ; Tautz, M. ; Talbot, J. ; Chan, C. ; Meassick, S.International Conference on Plasma Sciences (ICOPS), 1993, p.192IEEETexto completo disponible |
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Material Type: Acta de Congreso
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A proposed Strategy for Evolution of ESE Data Systems (SEEDS) standards processUllman, R. ; McDonald, K. ; Bedet, J.-J. ; Conover, H. ; Doyle, A. ; Enloe, Y. ; Evans, J.D. ; Suresh, R. ; Yang, J.IGARSS 2003. 2003 IEEE International Geoscience and Remote Sensing Symposium. Proceedings (IEEE Cat. No.03CH37477), 2003, Vol.1, p.663-665 vol.1IEEETexto completo disponible |