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11
Electrical properties and crystallization behavior of SbxSe100-x thin films
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Electrical properties and crystallization behavior of SbxSe100-x thin films

KANG, M. J ; PARK, T. J ; WAMWANGI, D ; WANG, K ; STEIMER, C ; CHOI, S. Y ; WUTTIG, M

Microsystem technologies, 2007, Vol.13 (2), p.153-159 [Periódico revisado por pares]

Berlin: Springer

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12
Soft X-ray Absorption and Photoemission Spectroscopy Study of Cobalt-Based Thermoelectric Oxides: Ca3CO4O9, Ca3Co2O6, and Bi2Sr2Co2Oy
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Soft X-ray Absorption and Photoemission Spectroscopy Study of Cobalt-Based Thermoelectric Oxides: Ca3CO4O9, Ca3Co2O6, and Bi2Sr2Co2Oy

KANG, J.-S ; LEE, H. J ; KIM, D. H ; FUJII, T ; TERASAKI, I ; PARK, H. L ; JEONG, Y. H ; MIN, B. I

Journal of electronic materials, 2009, Vol.38 (7), p.1127-1131 [Periódico revisado por pares]

Heidelberg: Springer

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13
Assessment of tight pixel geometry influence on surface chemistry of Hg1-xCdxTe focal plane array by time of flight-secondary ion mass spectroscopy : Novel analytical methods
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Assessment of tight pixel geometry influence on surface chemistry of Hg1-xCdxTe focal plane array by time of flight-secondary ion mass spectroscopy : Novel analytical methods

GARWOOD, G ; OLSHOVE, R ; PETTIJOHN, E ; BANGS, J ; LIGUORI, M ; OLSON, E ; LUA, F

Journal of electronic materials, 2007, Vol.36 (8), p.937-948 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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14
Accurate determination of the matrix composition profile of Hg1-xCdxTe by secondary ion mass spectrometry
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Accurate determination of the matrix composition profile of Hg1-xCdxTe by secondary ion mass spectrometry

WANG, Larry ; WANG, Alice ; PRICE, Steve

Journal of electronic materials, 2007, Vol.36 (8), p.910-912 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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15
Modeling strategies for fabrics unit cell geometry-Application to permeability simulations
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Modeling strategies for fabrics unit cell geometry-Application to permeability simulations

Hivet, Gilles ; Wendling, Audrey ; Vidal-Salle, Emmanuelle ; Laine, B. ; Boisse, Philippe

International Journal of Material Forming, 2010, Vol.3 (1 supplément), p.727-730 [Periódico revisado por pares]

Springer Verlag

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16
Characterization of physical-chemical drivers of Hg1-xCdxTe etch rate using time of flight-secondary ion mass spectrometry and optical interferometry
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Characterization of physical-chemical drivers of Hg1-xCdxTe etch rate using time of flight-secondary ion mass spectrometry and optical interferometry

OLSHOVE, R ; GARWOOD, G ; PETTIJOHN, E ; EMERSON, R ; LUA, F ; OLSON, E ; BANGS, J

Journal of electronic materials, 2006, Vol.35 (6), p.1185-1191 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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17
Laser processing of BN and AlN films
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Laser processing of BN and AlN films

NARAYAN, J ; WU, H ; VISPUTE, R. D

Journal of electronic materials, 1996, Vol.25 (1), p.143-149 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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18
AlGaAsSb buffer/barrier on GaAs substrate for InAs channel devices with high electron mobility and practical reliability
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AlGaAsSb buffer/barrier on GaAs substrate for InAs channel devices with high electron mobility and practical reliability

MIYA, S ; MURAMATSU, S ; KUZE, N ; NAGASE, K ; IWABUCHI, T ; ICHII, A ; OZAKI, M ; SHIBASAKI, I

Journal of electronic materials, 1996, Vol.25 (3), p.415-420 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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19
Group-V atoms exchange due to exposure of InP surface to AsH3(+PH3) revealed by x-ray CTR scattering
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Group-V atoms exchange due to exposure of InP surface to AsH3(+PH3) revealed by x-ray CTR scattering

TABUCHI, M ; YAMADA, N ; FUJIBAYASHI, K ; TAKEDA, Y ; KAMEI, H

Journal of electronic materials, 1996, Vol.25 (4), p.671-675 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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20
Adhesion of Ni-structures on Al2O3 ceramic substrates used for the sacrificial layer technique
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Adhesion of Ni-structures on Al2O3 ceramic substrates used for the sacrificial layer technique

KUNZ, T ; MOHR, J ; RUZZU, A ; SKROBANEK, K. D ; WALLRABE, U

Microsystem technologies, 2000, Vol.6 (4), p.121-125 [Periódico revisado por pares]

Berlin: Springer

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