Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Ata de Congresso
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Lessons from analysing mortality from six major flood events in France(1930-2010)Boudou, Martin ; Lang, Michel ; Vinet, Freddy ; Coeur, Denis Lang, M. ; Samuels, P. ; Klijn, F.E3S Web of Conferences, 2016, Vol.7, p.6005 [Periódico revisado por pares]Les Ulis: EDP SciencesTexto completo disponível |
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2 |
Material Type: Ata de Congresso
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Axiomatic systems and topological semantics for intuitionistic temporal logicBoudou, Joseph ; Diéguez, Martín ; Fernández-Duque, David ; Romero, FabiánSpringer 2019Texto completo disponível |
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3 |
Material Type: Ata de Congresso
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Electrical characterization of PEN films using TSDC and PEA measurementsHoang, M.-Q ; Boudou, L. ; Le Roy, S. ; Teyssedre, G.2013 IEEE International Conference on Solid Dielectrics (ICSD), 2013, p.488-491IEEETexto completo disponível |
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4 |
Material Type: Ata de Congresso
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Predicting the flow in the floodplains with evolving land occupations during extreme flood events (FlowRes ANR project)Proust, Sébastien ; Berni, Céline ; Boudou, Martin ; Chiaverini, Antoine ; Dupuis, Victor ; Faure, Jean-Baptiste ; Paquier, André ; Lang, Michel ; Guillen-Ludena, Sebastian ; Lopez, Diego ; Mignot, Emmanuel ; Rivière, Nicolas ; Chagot, Loic ; Rouzes, Maxime ; Moulin, Frédéric ; Goutal, Nicole ; Oukacine, Marina ; Peltier, Yann ; Ferreira, Rui M.L. ; Brito, Moisés ; Alves, Elsa ; Gymnopoulos, Miltiadis ; Leal, Joao ; Mathurin, Bastien ; Soarez-Frazao, Sandra ; Bousmar, Didier ; Fernandes, Joao ; Eiff, Olivier Lang, M. ; Samuels, P. ; Klijn, F.E3S Web of Conferences, 2016, Vol.7, p.4004 [Periódico revisado por pares]Les Ulis: EDP SciencesTexto completo disponível |
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5 |
Material Type: Ata de Congresso
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Improvements in process performance for immersion technology high volume manufacturingNafus, K ; Shimoaoki, T ; Enomoto, M ; Shite, H ; Otsuka, T ; Kosugi, H ; Shibata, T ; Mallmann, J ; Maas, R ; Verspaget, C ; van der Heijden, E ; van Setten, E ; Finders, J ; Wang, S ; Boudou, N ; Zoldesi, CProceedings of SPIE, the International Society for Optical Engineering, 2009, Vol.7273, p.727338-727338-11Bellingham, Wash: SPIETexto completo disponível |
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6 |
Material Type: Ata de Congresso
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Highly-Strained Silicon-On-Insulator DevelopmentAkatsu, Takeshi ; Hartmann, Jean-Michel ; Aulnette, Cécile ; Le Vaillant, Yves-Matthieu ; Rouchon, Denis ; Abbadie, Alexandra ; Bogumilowicz, Yann ; Portigliatti, Lionel ; Colnat, Cyrille ; Boudou, Nicolas ; Lallement, Fabrice ; Triolet, Fanny ; Figuet, Christophe ; Martinez, Muriel ; Nguyen, Phuong ; Delattre, Cécile ; Tsyganenko, Kira ; Berne, Cécile ; Allibert, Frédéric ; Deguet, ChrystelECS transactions, 2006, Vol.3 (6), p.107-117Texto completo disponível |
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7 |
Material Type: Ata de Congresso
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Correlation between Chemical and Electrical Properties of SiNx Deposed by PECVD. Impact on RF MEMS devicesLamhamdi, M. ; Pons, P. ; Boudou, L. ; Guastavino, J. ; Segui, Y. ; Plana, R.2007 IEEE International Conference on Solid Dielectrics, 2007, p.643-646IEEETexto completo disponível |
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8 |
Material Type: Ata de Congresso
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Chercheurs d'or et contamination par le mercure des systèmes aquatiques continentaux de Guyane : Risques à l'égard des populations humainesBOUDOU, A ; MAURY-BRACHET, R ; DURRIEU, G ; COQUERY, M ; DAUTA, CHydroécologie appliquée (Paris), 2006, Vol.15 (1-2), p.1-18 [Periódico revisado por pares]Paris: Electricité de FranceTexto completo disponível |
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9 |
Material Type: Ata de Congresso
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Si3N4 Thin Films Proprerties for RF-MEMS Reliability InvestigationLamhamdi, M. ; Boudou, L. ; Pons, P. ; Guastavino, J. ; Belarni, A. ; Dilhan, M. ; Segui, Y. ; Plana, R.TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, 2007, p.579-582IEEETexto completo disponível |
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10 |
Material Type: Ata de Congresso
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Conductivity of polyethylene - role of antioxidant and crosslinking by-productsBoudou, L. ; Guastavino, J. ; Zouzou, N. ; Martinez Vega, J.ICSD'01. Proceedings of the 20001 IEEE 7th International Conference on Solid Dielectrics (Cat. No.01CH37117), 2001, p.245-247IEEETexto completo disponível |