Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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Material Type: Artigo
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Predictions of weld pool profiles using plasma physicsTanaka, M ; Lowke, J JJournal of physics. D, Applied physics, 2007-01, Vol.40 (1), p.R1-R23 [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |
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Material Type: Artigo
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A computational investigation of the effectiveness of different shielding gas mixtures for arc weldingMurphy, A B ; Tanaka, M ; Tashiro, S ; Sato, T ; Lowke, J JJournal of physics. D, Applied physics, 2009-06, Vol.42 (11), p.115205-115205 (14) [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |
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Material Type: Artigo
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Residual stress measurement of an EB-PVD Y2O3-ZrO2 thermal barrier coating by micro-Raman spectroscopyTANAKA, M ; KITAZAWA, R ; TOMIMATSU, T ; LIU, Y. F ; KAGAWA, YSurface & coatings technology, 2009-12, Vol.204 (5), p.657-660 [Periódico revisado por pares]Amsterdam: ElsevierTexto completo disponível |
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Material Type: Artigo
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Low-Energy Consumption RSFQ Circuits Driven by Low VoltagesTanaka, M. ; Kitayama, A. ; Koketsu, T. ; Ito, M. ; Fujimaki, A.IEEE transactions on applied superconductivity, 2013-06, Vol.23 (3), p.1701104-1701104 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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Mechanisms giving increased weld depth due to a fluxLowke, J J ; Tanaka, M ; Ushio, MJournal of physics. D, Applied physics, 2005-09, Vol.38 (18), p.3438-3445 [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |
6 |
Material Type: Artigo
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Correlation between microstructure and barrier properties of TiN thin films used Cu interconnectsMoriyama, M ; Kawazoe, T ; Tanaka, M ; Murakami, MThin solid films, 2002-09, Vol.416 (1), p.136-144 [Periódico revisado por pares]Lausanne: Elsevier B.VTexto completo disponível |
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Material Type: Artigo
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Preparation and thermoelectric properties of BP films on SOI and sapphire substratesKumashiro, Y. ; Nakamura, K. ; Enomoto, T. ; Tanaka, M.Journal of materials science. Materials in electronics, 2011-08, Vol.22 (8), p.966-973 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
8 |
Material Type: Artigo
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Structure oriented compact model for advanced trench IGBTs without fitting parameters for extreme condition: Part ITanaka, M. ; Omura, I.Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1933-1937 [Periódico revisado por pares]Kidlington: Elsevier LtdTexto completo disponível |
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Material Type: Artigo
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Numerical simulation of metal vapor behavior in arc plasmaYamamoto, K. ; Tanaka, M. ; Tashiro, S. ; Nakata, K. ; Yamazaki, K. ; Yamamoto, E. ; Suzuki, K. ; Murphy, A.B.Surface & coatings technology, 2008-08, Vol.202 (22-23), p.5302-5305 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
10 |
Material Type: Artigo
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Design and implementation of a pipelined bit-serial SFQ microprocessor, CORE1βYAMANASHI, Y ; TANAKA, M ; AKIMOTO, A ; PARK, H ; KAMIYA, Y ; IRIE, N ; YOSHIKAWA, N ; FUJIMAKI, A ; TERAI, H ; HASHIMOTO, YIEEE transactions on applied superconductivity, 2007-06, Vol.17 (2), p.474-477 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |