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Material Type: Artigo
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An Effective Design of Wearable Antenna with Double Flexible Substrates and Defected Ground Structure for Healthcare Monitoring SystemMustafa, Ameena Banu ; Rajendran, TamilselviJournal of medical systems, 2019-07, Vol.43 (7), p.186-11, Article 186 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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Material Type: Artigo
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A 750-MHz Electronically Tunable Resonator Using Microstrip Line Couplers for Electron Paramagnetic Resonance Imaging of a Mouse Tumor-Bearing LegAmida, Tatsuya ; Nakaoka, Ririko ; Komarov, Denis A. ; Yamamoto, Kumiko ; Inanami, Osamu ; Matsumoto, Shingo ; Hirata, HiroshiIEEE transactions on biomedical engineering, 2018-05, Vol.65 (5), p.1124-1132 [Periódico revisado por pares]United States: IEEETexto completo disponível |
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Material Type: Artigo
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Ferrite-superconductor devices for advanced microwave applicationsDionne, G.F. ; Oates, D.E. ; Temme, D.H. ; Weiss, J.A.IEEE transactions on microwave theory and techniques, 1996-07, Vol.44 (7), p.1361-1368 [Periódico revisado por pares]IEEETexto completo disponível |
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Material Type: Artigo
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Symmetry of microwave devices with gyrotropic media-complete solution and applicationsDmitriyev, V.A.IEEE transactions on microwave theory and techniques, 1997-03, Vol.45 (3), p.394-401 [Periódico revisado por pares]IEEETexto completo disponível |
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Material Type: Artigo
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Thick film YBCO microstrip resonatorsMossavati, R. ; Gallop, J.C. ; Button, T. ; Alford, N.M.IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States), 1991-03, Vol.27 (2), p.2952-2954New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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Interactive interdigital filter design using MMICAD software. (Application Note)Dindo, Philip FMicrowave Journal, 2003-01, Vol.46 (1), p.140-146Dedham: Horizon House Publications, IncTexto completo disponível |
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Material Type: Artigo
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The application of microwave techniques in lightwave systemsSobol, H.Journal of lightwave technology, 1987-03, Vol.5 (3), p.293-299 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |