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Results of the PEP'93 intercomparison of reference cell calibrations and newer technology performance measurements
Results of the PEP'93 intercomparison of reference cell calibrations and newer technology performance measurements
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Results of the PEP'93 intercomparison of reference cell calibrations and newer technology performance measurements

Osterwald, C.R. ; Anevsky, S. ; Barua, A.K. ; Dubard, J. ; Emery, K. ; King, D. ; Metzdorf, J. ; Nagamine, F. ; Shimokawa, R. ; Udayakumar, N. ; Wang, Y.X. ; Wittchen, T. ; Zaaiman, W. ; Zastrow, A. ; Zhang, J.

Conference Record of the Twenty Fifth IEEE Photovoltaic Specialists Conference - 1996, 1996, p.1263-1266

IEEE

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2
The analysis on bridge between leads of quad flat package in reflow soldering on printed circuit boards
The analysis on bridge between leads of quad flat package in reflow soldering on printed circuit boards
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Ata de Congresso 		Adicionar ao Meu Espaço

The analysis on bridge between leads of quad flat package in reflow soldering on printed circuit boards

Lee, C. ; Yamamoto, K. ; Shimokawa, H. ; Soga, T.

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 1995, p.411-414

IEEE

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3
Development of Sn-Pb-Bi solder materials for fine pitch package
Development of Sn-Pb-Bi solder materials for fine pitch package
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Ata de Congresso 		Adicionar ao Meu Espaço

Development of Sn-Pb-Bi solder materials for fine pitch package

Yamamoto, K. ; Lee, C. ; Shimokawa, H. ; Ishida, T. ; Soga, T.

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 1995, p.232-235

IEEE

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